CA-180 low-temperature cure conductive adhesive is for die attach and general circuit assembly applications. Cures in 30 min. at 80°C, three min. at 100°C, or 10 sec. at 150°C with an electrical conductivity of 4 x 10^-5ohm-cm. Reportedly ideal for applications in which components are temperature-sensitive and require high conductivity interconnects. Has a 48-hr. work life and a 12,000 cP viscosity at 5 rpm. Was developed to pass reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications.

Engineered Material Systems, www.emsadhesives.com

phoenix x|aminer x-ray inspection system now comes with CMOS-flat panel detector.  With computed tomography (CT) capability and a CT-dedicated software package, is said to generate high-quality imaging for 3D and 2D inspection. Reportedly reduces time and costs in failure analysis, process control in printed circuit board assemblies and component inspection, and in research and development. Combines CT capability with CMOS imaging for improved signal-noise ratio and sharpness. New software package for CT applications further enhances nondestructive inspection (NDT) processes. Controls and monitors all components of the CT system, including microfocus x-ray tube, flat panel detector and work-piece manipulator, for greater control of projection data set creation, volume reconstruction and the visualization of volumes and projections. Performs simple and fast CT scanning with virtually instantaneous data acquisition or reconstruction.

GE Measurement & Control, www.gemeasurement.com/inspection-ndt/radiography-and-computed-tomography/phoenix-xaminer

Supreme 10HTF-1 single-part adhesive/sealant is for aerospace, electronics, optical and other applications. Is said to have an unlimited working life at room temperature and cures rapidly at elevated temperatures. Typical cure schedules are 5 to 10 min. at 300°F or 15 to 20 min. at 250°F. Delivers physical strength values for tensile lap shear, tensile and T-peel of >3,200 psi, 6,500-7,500 psi and 20-25 psi, respectively. Bonds to metals, composites, glass, ceramics, rubbers and many plastics. Has low shrinkage upon curing, is dimensionally stable and has a Shore D hardness >70. Withstands rigorous thermal cycling and mechanical shock and vibration. Offers cryogenic serviceability over the temperature range of 4K to +400°F. Resists water, fuels, acids, bases and many solvents. Is a reliable electrical insulator. Volume resistivity is 1013ohm-cm.

Master Bond, www.masterbond.com

Digital Position Setup Tool is designed for use on Ersa selective soldering machines such as Versaflow 3, Versaflow 4050 and Versaflow 5060. Can measure flux spray position up to 0.1mm position accuracy at the printed circuit board level. Deviations can be displayed on the machine or remotely. Machine verification is digitally controlled. Is designed for use with 3/6 nozzles; other nozzle options are available. Includes automatic calibration mode. Is compatible with other selective solder equipment depending on dimensions.

Kurtz Ersa North America, www.ersa.com