MEK Releases S1 mkll 5D SPI
Published: 24 September 2013
by Mike Buetow
Model S1 mkII solder paste inspection system performs high-speed 5D inspection (simultaneous 2D and 3D inspection). Re-engineered inspection head has improved 2D image capture. Patented sensor technology simultaneously combines 2D and 3D image processing, reducing inspection tolerances. True area, shape, volume, offset and height measurements provided in combination, for process control.
MEK Europe, www.mek-europe.com
TAGS: MEK, solder paste inspection, AOI, printing, SPI, SMT
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