Designed for electronics manufacturing, prototyping and production environments, the FX-310 wave soldering pot features a two-piece architecture with a separate control module and flat-top design to accommodate larger printed circuit boards. Supports operating temperatures up to 380°C and includes NP01 Series nozzles, nitrogen input, leak detection, five programmable process presets and Ethernet connectivity for remote setup and monitoring. An enclosed solder pot helps reduce oxidation, while adjustable temperature, solder flow rate, flow duration and descent speed provide greater process control and repeatability.

Designed to reinforce fine-pitch, leadless components on printed circuit boards, 9310 light-curing adhesive provides additional mechanical strength for assemblies exposed to vibration, thermal stress and other demanding conditions. The adhesive supports rapid curing for automated production and is intended to reduce component movement and improve assembly reliability in automotive, industrial, medical, communications and consumer electronics applications.

Designed for specialized Fuji pick-and-place applications, the 2026-5679 custom DX S1 base features a spring-loaded nozzle shaft, 8mm bellow suction cup, 16.05mm center spacing and ID dome clearance. Manufactured to customer specifications, the precision-machined component is designed to address specialized component handling and placement requirements not served by standard tooling.

Adding optional camera and monitor configurations to improve visibility during SMT and BGA rework, the TRIDENT benchtop rework station can be equipped with a top-mounted monitor and freestanding camera, while the INTRUDER hot-air BGA rework station adds a monitor capable of switching between split-vision and side-angle camera views. The INTRUDER also features a repositioned top-mounted computer monitor, while both systems are designed for component removal and replacement in precision rework applications.