The Multi Line Assist 11XX Series combines assembly guidance and automated optical inspection for THT production environments. The system projects assembly instructions directly into the operator's field of view and verifies component placement through integrated AOI inspection, detecting polarity errors, missing components and marking deviations during or after assembly. Features MagicLight technology, which combines top and side lighting with coded illumination to improve visibility of difficult-to-inspect features such as polarity markings and embossed text while reducing reflections and sensitivity to ambient light. Available as a complete workstation, tabletop retrofit system or integration module, the platform is designed to support manual assembly stations and automated production lines. Test results can be documented, analyzed and transferred to MES systems.

The ARKV6S is an NDAA-compliant flight controller designed for UAV and robotics applications. Based on FMUV6X and Pixhawk Autopilot Bus (PAB) specifications, the controller supports PX4 Autopilot and ArduPilot firmware and is compatible with PAB carrier boards for flexible system integration. Features industrial-grade sensing technology, including an inertial measurement unit, barometric pressure sensor and magnetometer. Additional features include onboard FRAM storage, MicroSD data logging, status LEDs and a dedicated heater designed to maintain sensor performance in low-temperature operating environments.

Rapid NPI and RapidRFQ are designed to accelerate product launches and quoting for electronics manufacturing programs. Rapid NPI applies supply chain, sourcing and process engineering strategies to reduce traditional new product introduction timelines by 40-60%, enabling prototyping, tooling and production planning activities to occur in parallel. RapidRFQ is an automated PCB assembly quoting platform that generates manufacturable quotes from uploaded BOMs, Gerber files and pick-and-place data. The system uses live supplier information to automate BOM scrubbing, sourcing and pricing, providing visibility into component availability, lead times and manufacturing costs within minutes.

The OE in a Box Full Process Kit and OE in a Box High Density Kit are designed to help electronics manufacturers generate IPC J-STD-001 objective evidence and qualify assembly processes for electrochemical reliability. Include test cards, taped-and-reeled components, SIR testing services and certificates of compliance upon successful completion. Supports qualification of top- and bottom-side SMT assemblies, multiple soldering methods and conformal coating processes.