Creative Materials, a supplier of electrically conductive inks, coatings, adhesives and encapsulants, announced an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy, 123-38A/B187, designed for flip-chip assembly.          

Flip-chip replaces wire bonding as the electrical connection of electronic components onto substrates or circuit boards.  A process long used in the automotive industry, flip-chip assembly is growing in popularity among makers of cell phones, handheld electronic devices and microprocessors.  

GPC-251A/B is a silver filled, electrically conductive, two-part, room-temperature curing adhesive used to connect the bumps on the underside of circuit boards. It cures in 24 hr. at 25°C, 60 min. at 65°C and in five min. at 120°C.

123-38A/B-187 is a thermally conductive underfill epoxy that strengthens the chip package, protecting it from moisture while adding mechanical strength.  Is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface.  Low viscosity makes it ideal for underfilling applications. 

Creative Materials, creativematerials.com