Dow Corning SE 4451 thermally conductive encapsulant has a pre-qualified, turnkey dispensing process. The combined material-and-process offering is one of the first developments to emerge from the External Equipment Provider Alliance launched by Dow Corning earlier this year.

Designed for the heat-management needs of electronic power devices, the encapsulant offers thermal conductivity of 3W/mK at 25°C and 32,000 cPs viscosity. The material's properties enable fast dispense and cure times.

Dow Corning worked with alliance member and dispensing equipment provider Liquid Control Corp. to develop a turnkey dispensing process for the new encapsulant.

The companies will discuss the product and process during a one-hour online seminar on thermal interface materials on Nov. 11, at 11 a.m. EST. Click for more info. 

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