The 2005 AS-Interface Selection Guide is a full-color resource to assist users in selecting AS-Interface components for their application. 
 
Featured technologies include scanners and gateways, power supplies and repeaters, I/O modules, Safety at Work components, intelligent photoelectric and inductive sensors, as well as rotary encoders, accessories and cables.  Visitors can request a hard copy or download PDF information at: www.am.pepperl-fuchs.com/literature/litform.asp
 
Pepperl+Fuchs

CATSWeb Records Management allows easy, effective compliance with corporate record retention policies. Designed to address business requirements for electronic recordkeeping and compliance, while allowing a quick ROI, compliance enforcement and lower exposure to risk.

 

Automates the process of archiving or purging records and documents that meet configurable criteria. Facilitates compliance with regulatory requirements and standards related to records management; improves productivity and effectiveness of administrative staff; minimizes legal liabilities by ensuring that records are kept for only as long as they are useful and needed, consistent with corporate policies; and eases location and retrieval of archived records via integration with record-level audit trail and built-in query and search engines.

AssurX Inc., assurx.com

A new tier of elastomeric connector products is available with proprietary Z-Alloy material. The connectors combine the reliability of solid metallic contacts with the flexibility of the silicone support material into one economical package.  Are corrosion-resistant and offer a cost savings compared to traditional gold-plated contacts.
 
Standard connectors feature .002" (0.05 mm) wide conductors on .004 " (0.1 mm) centers for a conductor density of 250 per inch. Despite the fine geometry of the contacts, the material is said to be strong and durable enough to withstand repeated uses and will not break or fracture. 
 
Z-Axis Connector Co., zaxisconnector.com

ALPHA CoolCap thermal protection device cools components and semiconductor packages during high-temperature lead-free reflow and rework processes.
 
Said to provide cost-effective protection without a substantial investment in process changes and redesign, while maintaining the high yield and throughput required by electronic assemblers. The reusable custom-fitted caps keep semiconductor packages below 245°C or 260°C and minimize temperature variation within packages from over 10°C down to 2-5°C, while minimizing warpage, popcorning and delamination.
 
Can be used in no-clean, water-soluble or RMA processes as a temporary heat sink that can be placed on components either by hand or with existing pick-and-place equipment.  No adhesive is required and no residue is left on boards or components. Can be designed to cool the package body, allowing reflow underneath, or to "overcool" - preventing reflow in cases such as adjacent packages during rework. 
 
Cookson Electronics Assembly Materials, alphametals.com