CR-5000 Lightning was created to meet the demands of increased electronics design complexity resulting from the growth in density, miniaturization and multi-functionality of products.

The unique technology was born from collaboration between R&D teams in  Japan, the UK and Germany. Combines PCB design and simulation for fast, efficient design that enables users to solve high-speed design issues early in the process. 

Fully integrated design environment into CR-5000 Board Designer and CR-5000 System Designer ensures a fully adopted frontloading approach, allowing users to share information through a unified database within the high-speed design environment. In-depth analysis and what-if capabilities available throughout the design process enable engineers to explore design scenarios, trading off signal integrity parameters such as crosstalk, timing or EMI requirements, against mechanical and thermal constraints.

Offers:

Unified and shared design constraints, to eliminate complexities associated with separate design and provide control for activities such as circuit design, floor plans and board design;

Unification and communication between board design and system design with high-speed constraints and analysis;

Unified Analysis Engine Sharing;

and Frontloaded Verification.

Additional features include 'Trunking', H-Tree Routing and Interactive Lengthening.

Zuken, zuken.com

Total Parts Plus’ material content database has expanded its coverage for electronic and non-electronic components to more than 2.5 million part numbers. Data coverage includes full and partial content information, Restriction of Hazardous Substances (RoHS) compliancy flags, lead-free identification, exemption tracking, compliant alternates, tin whiskering data and reflow temperature.

Total Parts Plus has been collecting material content data since the announcement of the European Directives and has added RoHS compliancy flags to its material disclosure information to help manufacturers identify compliant replacements quickly.

Libra Industries has introduced a lead-free transition services package to help manufacturers extend their internal engineering capacity to successfully comply with the RoHS directive. 

The package consists of in-house BOM review and conversion, and assistance with product redesign though Libra’s Design Service.  The company has partnered with Engent Inc. (Norcross, GA) to offer pilot assembly and reliability testing for new lead-free product designs. These services are available a la carte, or as a complete package.

Libra Industries, libraind.com

DEK will show its cost-saving, throughput-enhancing packaging technologies at  booth #7111 during Semicon West in San Francisco.

The company will demonstrate its backside wafer coating process, which is said to allow high throughput on a cost-effective mass imaging system and is capable of exceeding the +/- 12.5mm Total Thickness Variation (TTV) required by most wafer processing manufacturers.

Enabled by metal stencil and emulsion screen technologies, materials can be deposited accurately at high speeds, while achieving control over print thickness and ensuring uniformity. This process will be shown on the Micron-class Galaxy printer platform.

Other packaging applications on display will include: Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by ProFlow DirEKt Imaging technology; encapsulation that only requires one print stroke; singulation technology utilizing Virtual Panel Tooling (VPT); repeatable ball placement technology and high speed substrate bumping. 

DEK, dek.com