Speedline Technologies has released Benchmark 5.0 software for its Camalot XyflexPro liquid dispensing system for surface mount electronics and chip packaging applications.
The new release reportedly offers increased throughput of up to 15%, improved process control and enhanced program functionality.
New features include a Flip Chip Calculator, used to determine underfill weight and volume for both die within a cavity and standard assembly methods. TurnBack allows any of the dispense units or pumps to be reversed. This gives precise control of material on the needle tip and can eliminate material balling or dripping due to backpressure.
Also features Die Edge Detection, a one-snap process that simultaneously finds all four edges of a flip chip for pinpoint positioning. The vision algorithms have been further developed for edge find of any rotated die, CSP/BGAs and other molded packages.
Line Sequence command for faster, smoother travel around corners when dispensing underfill; encapsulation and micro display applications; needle cleaning during product transfer; faster vision processing; and a pipeline conveyor mode that allows parallel product transfer between conveyor zones help to reduce transfer time by up to 40%.
Easily upgradeable, available as an option for all existing XyflexPro users and shipped standard on new systems.
Speedline Technologies, speedlinetech.com
Mentor Graphics Corp. released version 2005.1 of the Capital Harness Systems (CHS) product suite, an end-to-end software toolset for the design, analysis, engineering and production of electrical interconnect systems such as those found on transportation platforms. Users can select from a range of fully integrated tools.
Version 2005.1 contains more than 140 separate enhancements across the various software tools, including:
* Preferred component declaration and selection
* Configurable release behaviors
* Extended name composition capabilities
* Support for connector backshells
* Configurable cross-referencing
* Flexible electrical analysis scoping
* Whole vehicle wiring diagram synthesis
* Layered insulation display
* Additional cost modeling variables
* First integration capabilities with UGS TeamCenter Engineering
Mentor Graphics Corp., www.mentor.com
UK-based MicroStencil launched a new production facility for the manufacture of ultra-fine pitch screen printing stencils.
Following its spin-out from Edinburgh's Heriot-Watt University, additional investment has now enabled the company to expand stencil manufacturing at its headquarters in Livingston with the installation of a class 100 cleanroom and customized production equipment based on the semiconductor manufacturing processes.
The company provides an electroformed stencil that allows the fabrication of sub-100 micron aperture pitch. The stencil has the potential to deliver considerable advantages in interconnecting technology and offers in screen printing for wafer bumping and chip bonding.
The process forms high tolerance apertures with extremely smooth sidewalls. Such stencils are beginning to enable printing at sub-150 micron pitch. While current methods of applying solder bumps using stencil printing cannot cost-effectively get below a 150µm aperture pitch, severely restricting the use of flip-chip packaging, MicroStencil can push the limits down to 10µm aperture size and 10µm web space.
The technology achieves high-density electrical interconnects leading to higher portability and functionality in portable electronics devices.
www.micro-stencil.com
Cookson Electronics Assembly Materials has launched ALPHA EF-10000, the latest addition to its lead-free no-clean wave solder flux technology. The high rosin, no-clean, alcohol-based product passes international reliability standards, including JIS, IPC and Bellcore, while reportedly providing broad process compatibility and excellent first pass yield in both lead-free and tin-lead wave soldering applications.
Said to deliver best-in-class top side hole fill on a variety of common plated through-hole sizes; is fully capable with SAC and eutectic tin-lead alloys. Resists micro solder ball formation.
“ALPHA EF-10000 flux passes the JIS, IPC and Bellcore electrical reliability standards enabling electronic assemblers to build strong, durable joints in both lead-free and tin-lead processes,” said Steve Brown, global product manager at CEAM.
Cookson Electronics Assembly Materials, alphametals.com