RO-CONTROL software combines important functions for process evaluation and process control for reflow ovens. It simulates temperature profiles with different oven settings and enables the comparison with a profile reference from the solder paste library. Controls the reflow oven and assures quality.

The effect of different oven settings to the reflow profile can be studied in advance and parameters can be optimized without tests. The simulation program calculates the reflow profile from the zone temperatures, the conveyor speed and a PCB constant.

The simulated temperature profile can be compared with the guidelines of the solder paste manufacturer. The available solder paste library can be expanded by the user.

The real temperature profile on the PCB can be measured using two optional thermocouples. Measurements are shown graphically. For process analysis profile comparison the antecedent simulated profile and the solder paste reference can be superimposed.

ESSEMTEC AG, essemtec.com

 

 

 

AdVantis XS is designed for the convergence of semiconductor and standard surface-mount assembly, uses VRM linear motors for accuracy and repeatability.
 
Evolved from the company’s GSMxs, delivering accuracies of +/-9 microns at +/- 3 sigma, but with a reported 25% increase in feeder capacity and a 15% speed improvement. Advanced materials engineering and optimized design available at a price 25% lower than its predecessor.
 
Includes high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing and a variety of feeder types. Is Class 1000 clean room compatible.
 
Universal Instruments, uic.com

Electronics engineers requiring the condensed system architecture in camera inspection and vision-aided robotics applications but needing the transmission performance available from larger connectors in Camera Link applications can take advantage of Shrunk Delta Ribbon (SDR) Connectors and 0.8 mm Cable Assemblies from 3M Electronics. 
 
Comprised of RoHS-compliant boardmount connectors and a variety of cable assemblies developed to address Camera Link and mini Camera Link (mini CL) interface requirements while offering signal integrity.
 
New connector provides a variety of SDR solutions for Machine Vision and CL applications that require a smaller form factor with high transmission speeds.
 
SDR Connector uses a ribbon contact system with a 0.8 mm contact pitch. SDR low profile, polarized boardmount connectors are constructed of high temperature plastic bodies with 30 micron gold contacts, stamped metal EMI/ESD interface, and come with installed jack sockets and supporting board mounting hardware.  The installed jack socket supports the corresponding assembly thumbscrew interface.
 
Boardmount products are offered in both vertical and right-angle RoHS-compliant PTH and SMT attachments.
 
SDR Cable Assembly consists of rugged, over-mold shells with a thumbscrew locking system.  Come in a variety of MDR/SDR configurations. Uses 28 AWG cable and wiring configurations that meet legacy CL specifications. Available in 30 AWG configuration upon request.
 
 
3M has added two features to its CL assembly offering for both MDR and SDR.  The first is an over-mold, right angle configuration that provides a low profile, thumbscrew interface which reduces the assembly profile by more than four inches compared to traditional straight-exit backshell options. The second is an extender assembly for adding length to existing cables or providing means for bulkhead/mid-span/pass-through requirements. Extender cables feature over-mold MDR receptacles.
 
 
3M Electronics, 3M.com
 
 
 
 

Z-2000 series of flame, furnace and tandem atomic absorption spectrophotometers can accurately determine low concentrations of toxic elements such as cadmium, mercury, lead and hexavalent chromium. This is of increasing importance with the implementation of the Waste 
Electrical and Electronic Equipment Directive and the planned implementation of the Restriction of Hazardous Substances.
 
A new method of sample preparation for polyethylene samples uses high pressure microwave digestion with nitric acid. This replaces traditional extraction methods using sulphuric acid which is not suitable for the measurement of  lead. Details of the new  extraction method can be found in a new technical data sheet. (AA Sheet No. 72) For a copy,  e- mail: info@hitachi-hitec-uk.com.
 
Has polarized Zeeman background correction method on both flame and furnace instruments, for effective background elimination and stable baselines. The dual-beam optics feature twin detectors. Detection limits for the flame instrument (in micrograms/g) are Cd: 2, Pb: 50 and Cr: 
50. For the furnace instrument they are: Cd: 0.01, Pb: 0.25 and Cr:  0.2.
 
Hitachi High-Technologies Corp, hitachi-hitec-uk.com