ProLINE-RoadRunner XLF inline automated programmer programs flash memory and microcontroller devices using FlashCORE II. Extra large format supports device sizes up to 32 mm sq. and tape widths of 32 mm and 44 mm. Can be reconfigured to support small- to medium-sized devices in tape widths of 16 mm and 24 mm. Features automatic supply application software. Initially available exclusively for Siemens assembly machines.
 
Data I/O Corp., www.dataio.com
 

The upgraded YTV F1 Series AOI inspects solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is said to be for high-volume or high-mix manufacturing environments; also for pre/post-reflow applications. Has four oblique viewing cameras; offers inspection for R-nets. Improved Fusion lighting, with multi-color solder joint inspection, reportedly delivers 20% higher detection capabilities compared to previous models. Offers offline programming and a standard package library. Real-time SPC monitoring is standard.
 
YESTech Inc., www.yestechinc.com

The PC3200 series of fast-setting, one-component conductive adhesives is for connecting passive components and bare dies on lead frames and PCB substrates. Uses are said to include smart cards and flexible circuits found in camera phones, automotive or semiconductor applications. Is a one-part system that reportedly requires no premixing. Does not have to be stored below 40ºC, nor shipped in dry ice. Solvent-free and formulated for stencil print, screen printing or dispensing applications.