SN100C Pb-free solder spheres are said to offer impact strength and have smooth surfaces free of shrinkage effects. High ductility ensures high impact strength. Additional features include stable intermetallic compound and slow growth of interfacial intermetallic. Suitable for BGA, CSP, MCM and high-density fine-pitch applications.
 
Nihon Superior, www.nihonsuperior.co.jp
 

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