Siplace BulkFeeder X eliminates component reels. Permits tapeless supply of components in sizes 0402, 0201 and 01005 for high-speed applications. Sets up like any classic feeder on changeover table, but holds up to 1.5 million components at a time. Coordinates interplay of shutter and vibration mechanisms, vision system, and placement heads. Eliminates splicing. Uses a vibrating mechanism to pour loose components from a container onto a pickup plate made of glass. Built-in camera takes a picture of the components from underneath the glass plate. The placement machine analyzes the image and determines which components are located on the plate in a position that is suitable for pickup and which are not, for example because they are upside down or too close to each other.
ASM Assembly Systems, www.siplace.com
Mycronic 4.0 automated, intelligent factory software for just-in-time production enables visibility planning, material tracking, efficient changeovers, automated replenishment and intelligent storage solutions.
Mycronic, www.mycronic.com
DEK Nano Ultra Stencil is said to improve solder paste transfer by up to 40% in fine-pitch applications with area ratios of less than 0.6. Benefits include volume stability; clean edges for improved print quality; higher process stability; lower underscreen cleaning frequency (reduced underscreen cleaning fabric and cleaning solvent consumption). Coating thickness of 2 to 4µm.
ASM Assembly Systems/DEK, www.dek.com
Siplace TX series placement machines place components down to 03015/0201 metric in high volumes.
RSV series convection reflow soldering ovens include vacuum to reduce voids to fewer than 1%. Come in five or six heating zone versions, each with one vacuum zone and two cooling zones. Footprint is 5,070mm up to 6,229mm. Handle PCBs from 100 x 150mm up to 330 x 250mm. Large flux collection unit is said to reduce flux cleanings to a few times per year.
Eightech Tectron, www.eightech.com
Maxrel solder alloy comes in solder paste, preform and wire formats. Maintains shear strength after 1,000 thermal cycles under high CTE mismatch conditions. For LED chip-on-board (COB) assembly where high CTE mismatch can exist between the die stack and substrate, and creep fatigue properties of the solder material are important.
Alpha, alpha.alent.com/Markets/LED