Hanau, February 4, 2025 – Heraeus Electronics is pleased to announce that as of February 1st, 2025 Toni Versluijs has been appointed President of Heraeus Electronics. He succeeds Dr. Klemens Brunner, who has joined the Heraeus Group Management Committee and taken on responsibility for the Business Platform Electronics & Semiconductor as of June 2024.
Toni Versluijs has held various Executive positions in the Semiconductor industry in the past e.g. at NXP Semiconductors and Nexperia. Additionally, he serves as the Chairman of the Supervisory Board of the Chip Integration Technology Centre in Nijmegen.
“As a seasoned executive with a track record of successfully leading international Semiconductor businesses Toni has got a deep knowledge and understanding of the semiconductor industry as a whole and the global Semiconductor supply chains. I am sure that his extensive experience will be a great asset and will help to master the challenges that the Semiconductor industry is facing and successfully capture the opportunities”, said Jan Rinnert, CEO and Chairman of the Board of Managing Directors of Heraeus Group.
"I am pleased that we have found my successor for the position of President of Heraeus Electronics. I am looking forward to working with Toni to grow the business and capture the tremendous opportunities that are ahead of us in the Semiconductor industry”, Dr. Klemens Brunner, Member of the Group Management Committee, added.
Toni Versluijs holds an MSc in Physics from Radboud University and a Professional Doctorate in Supply Chain Management from Eindhoven University of Technology.
About Heraeus Electronics
Heraeus Electronics, part of the broadly diversified and family-owned global technology company Heraeus Group, is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio - from materials and material systems to services. To learn more about Heraeus Electronics, visit www.heraeus-electronics.com.
RENEX has signed an exclusive distribution agreement with US-based distributor Technica USA.
Under this partnership, Technica USA will distribute the REECO brand of ESD and cleanroom products in key territories, including California, Oregon, Idaho, Nevada, Arizona, New Mexico, Colorado, and Wyoming – with nonexclusive coverage in Washington and Utah.
“We are honored to be chosen as the first distribution partner for RENEX in the United States, representing and supporting the REECO brand of ESD and cleanroom products. These products meet the highest quality standards, and their design reflects a deep understanding of the needs of end-users. The addition of the REECO brand complements our portfolio of best-in-class solutions for our customers,” says Frank Medina, President/CEO of Technica USA, in a press release.
Technica USA, has been operating since 1985, providing equipment and materials to the PCB Fab, Substrate, PCB Assembly, and MEMS markets. The company specialises in sales, installation, service, and inventory management.
“This agreement with Technica USA is an important step in strengthening the presence of the REECO brand in the United States. Technica’s professionalism, market expertise, and dedication to customer satisfaction make them an ideal partner. Together, we aim to ensure that the REECO product line exceeds the expectations of industry professionals, delivering reliable solutions tailored to their needs,” says Predrag Topić, owner of RENEX.
Lakeville, Minnesota, February 4, 2025 – ITW EAE will be showcasing its latest developments at IPC APEX, March 18 - 20 in Anaheim. The ITW EAE booth #2400 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
Camalot will be demonstrating their Advanced Tilt and Rotate option on the Prodigy dispensing system. This innovative and patented feature reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.
Electrovert wave solder will feature the new Tunnel Heater option on the Electra wave soldering system. The Tunnel Heater option offers multiple benefits to board manufacturers: improved temperature capability and control of profile ramp rates, increased heated length without increasing the length of the machine, increase production line efficiencies with no impact to the N2 tunnel performance, and a full package solution with the ability to reduce N2 consumption compared to other inerting technologies. Electrovert will also feature the Heavy-Duty Finger Conveyor option which is designed to address the increasing demands of PCB production in terms of weight, throughput capability and process flexibility.
Electrovert introduces the new Aquastorm 160, equipped with the advanced Hurricane System, a cutting-edge cleaning solution that combines powerful performance while maintaining a compact design. Its Powerful Intermix nozzles ensure superior rinse efficiency, and the versatile 24” conveyor width accommodates a wide range of PCB sizes. The patented Torrid Dryer guarantees optimal drying, while Checkmate 4.0 enhances product control and precision alignment. The system also features improved chemical isolation to reduce consumption. With advanced capabilities for datalogging, CFX and OPEN APPS, the AS160 supports seamless tracking and communication protocols. With these innovations, the Aquastorm 160 delivers top-tier cleaning performance while optimizing both operational efficiency and environmental sustainability.
MPM will conduct live demonstrations of the award-winning Edison II ACT printer. The MPM® Edison™ II ACT is a state-of-the-art automated changeover solution for establishing a solid step ahead toward the industry mega trend. It is designed for simplicity, ease of adoption, scalability, and creating attractive ROI for users. With a built-in ±8 micron machine alignment, and ±15 micron wet print accuracy (≥2 Cpk @ 6 sigma, Edison's wet print accuracy is 25% better than the next best printers. Edison II ACT provides a cost-effective solution for labor intensive and error prone product changeover task, it enables quicker & simpler, reduced labor dependance, and error free changeover.
Vitronics Soltec will feature Centurion Reflow Oven with True N2 to Air Switching. This innovative feature provides flexibility and ease of use, enabling users to effortlessly switch between nitrogen and air atmospheres at the push of a button. This capability ensures the reflow oven tunnel remains optimally clean, whether operating in air or nitrogen mode. Additionally, the Centurion reflow oven will soon be produced in the USA—be sure to stop by for more details!
Despatch will showcase the LFC1–38 Class A bench-top oven. The LFC1-38 oven was designed to meet the rigorous safety standards outlined by NFPA 86. Engineered specifically for applications involving flammable solvents or significant moisture removals, this advanced oven features a pressure relief panel, purge timers and exhaust fan to ensure safe operation. Utilizing horizontal recirculating airflow, the LFC oven guarantees uniform temperature distribution, optimizing performance and reliability in high cost of failure environments.
ITW EAE, a division of Illinois Tool Works, Inc., is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together the world’s leading brands of electronics assembly equipment: MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions and Despatch Thermal Processing Technology. For more information visit www.itweae.com.
Atlanta, Georgia – Koh Young, the industry leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for live demonstrations of its award-winning inspection technologies. The event, taking place at the Anaheim Convention Center in California from March 18–20, 2025, offers a first-hand look at the future of AI-powered process optimization and quality assurance solutions.
Koh Young continues to revolutionize process improvement for electronics manufacturers with cutting-edge AI-powered innovations. At the show, attendees will experience groundbreaking solutions that simplify programming, enhance defect detection, and enable real-time process control:
• Solder Paste Inspection (SPI): The industry-standard 8030 Series delivers repeatable 3D measurement to optimize the print process and improve production quality, while the aSPre 3 sets new standards in accuracy and throughput.
• Automated Optical Inspection (AOI): The Zenith Series provides True3D inspection for precise defect detection, overcoming challenges posed by SMT components, while delivering top and bottom THT inspection capabilities.
• Automated Pin Inspection (API): The KY-P3 lineup offers unmatched accuracy and repeatability for mixed pin and SMD inspection using AI-powered vision algorithms.
• Dispense Process Inspection (DPI): The award-winning Neptune, with Koh Young L.I.F.T. technology, delivers the industry’s first 3D inspection solution for transparent material thickness inspection at production speed.
• Smart Factory & Process Optimization: AI-driven KSMART and Koh Young Process Optimizer (KPO) solutions automate process control, improve defect detection, simplify programming, and deliver real-time decision-making for enhanced production quality and cost savings.
Beyond our own booth, Koh Young is showcasing its advanced solutions in collaboration with industry leaders. Visit Panasonic Booth 830 to see the 8030-3 SPI and Zenith UHS AOI in action, demonstrating seamless connectivity and integration.
Experience the Future of Inspection at IPC APEX EXPO
Join Koh Young at Booth 2130 to discover how our advanced inspection solutions can transform your manufacturing processes. Register for the in-person event at https://www.ipcapexexpo.org/, or visit www.kohyoungamerica.com to learn more about our industry-leading inspection technology.
About Koh Young Technology
Founded in 2002, Koh Young transformed the inspection industry with the first 3D Solder Paste Inspection (SPI) system using patented dual-projection Moiré technology. Today, it is the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) solutions, serving over 3,600 customers with more than 24,000 systems installed worldwide. Koh Young continues to drive innovation, expanding into new markets with solutions for machined parts, press-fit pins, conformal coatings, and semiconductor packages. With a strong customer focus, its R&D efforts develop cutting-edge solutions based on user needs and industry trends. Headquartered in Korea, Koh Young’s global network spans Europe, Asia, and the Americas, ensuring localized support and close engagement with its growing customer base. Learn more at www.kohyoungamerica.com or www.kohyoung.com.
For More Information
Koh Young America • 1950 Evergreen Boulevard, Suite 200, Duluth, Georgia 30096 • +1.470.374.9254
Brent A. Fischthal, Head of Global Marketing Communications • www.kohyoungamerica.com • america@kohyoung.com
Milledgeville, Georgia, USA - TopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California. TopLine provides unique and innovative component-level solutions and learning tools including Daisy Chain Test Packages, very large BGA 2.5D Heterogeneous packages, Jumpers and Spacers for PCB, Glass Components for underfill practice, and more. TopLine also provides PCB test kits for solder practice and machine run.
TopLine engineers will be available in the booth to discuss all of the various products and technologies that the company supplies.
For example, Founder and CEO Martin Hart recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers, Aerospace, and many next-generation applications, including Very Large 2.5D Packages.
TopLine is a pioneer in CGA Solder Columns Technology and Low temperature cryogenic package-to-board interconnects. TopLine is also a supplier of Bonding Wire for many semiconductor uses and for EV applications.
About TopLine
TopLine manufactures a wide range of solder columns for CCGA semiconductor packages and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.
WOOSTER, OH— February 2025 — RBB Systems, a trusted leader in electronics manufacturing since 1973, is helping manufacturers achieve precision, reliability, and efficiency with its Custom Industrial Control Panels. Designed to meet the diverse and complex needs of modern manufacturing, RBB provides turnkey and labor-only solutions, ensuring customers receive high-quality, fully compliant control panel assemblies.
RBB’s UL 508A-certified panel shop is staffed with experienced technicians specializing in the assembly and integration of electrical, pneumatic, and hydraulic controls. The company serves industries such as food and beverage, automotive, and energy management, offering a flexible, scalable approach for one-off, batch, or recurring builds.
“Our goal is to deliver precision-built, error-free control panels that exceed industry standards,” said said Bruce Hendrick, CEO and Owner of RBB. “We take complete accountability for every assembly, ensuring rigorous testing, compliance with all specifications, flawless PCB board integration when required.”
RBB’s control panel and mechanical assembly area adheres to strict documentation, testing, and inventory control protocols, ensuring secure electrical connections and full compliance with UL, CSA, CE, and ATEX specifications. The facility is equipped to handle NEMA 4, 4X, 7, and 12 Class 1, Div. 2 enclosures, making RBB the preferred partner for businesses requiring high-performance control panel solutions.
In addition to control panel assembly, RBB specializes in integrating PCB board assemblies into completed panels, offering a one-stop solution that saves time, reduces costs, and enhances product quality through expert troubleshooting and system integration.
For manufacturers facing tight production schedules, personnel limitations, or complex assembly challenges, RBB delivers responsive, high-quality solutions tailored to specific needs.
To learn more about RBB’s custom industrial control panels and PCB integration, visit www.rbbsystems.com.
About RBB Systems:
RBB Systems specializes in small batch electronics manufacturing, offering expertise in customized solutions since 1973. With a focus on quality and collaboration, RBB serves clients across industries from its headquarters in Wooster, Ohio.
About LogiSync, LLC: Founded in 1993, LogiSync provides advanced engineering and design solutions, leveraging cutting-edge technology to create innovative, efficient designs for clients worldwide.