Press Releases
MOUNT PLEASANT, PA – Intervala LLC, a premier full-service electronics manufacturing services (EMS) provider, today announced that Teresa Huber, will transition from serving as president and chief executive officer (CEO) into a strategic advisor role for the Company. Robert McKernan has been named president and CEO. Huber and McKernan continue as members of the Company’s board of directors.
“Rob is an exceptional and proven leader with more than 20 years of senior executive leadership experience in the industrial technology arena,” said Chairman of the Board John Hathaway. “He is joining Intervala from Schneider Electric where he last served as president of one of Schneider’s most rapidly growing business units. He has significant experience building high-performance teams that deliver exceptional levels of customer satisfaction, which is an essential element of Intervala’s culture and business strategy. In addition, as a member of the board, Rob is already very knowledgeable about Intervala, its customers and how it does business.”
Commenting on his appointment, McKernan said, “Intervala is a special company with a unique, customer-focused culture, and I am honored to step into the role of president and CEO. Our extensive range of integrated manufacturing, engineering and customer satisfaction capabilities, along with our strong financial health, give Intervala a distinct advantage within our industry. And I believe that our established base of top-tier customers and the technology-driven markets we serve offer outstanding opportunities for further growth and expansion. My immediate priority is to ensure this leadership transition is as seamless as possible for our customers. I am grateful to Teresa for her vision and outstanding leadership during the last nine years and look forward to her insights as a strategic advisor. Further, I am excited to work closely with our talented team to convert Intervala’s strengths into even greater success for our stakeholders.”
“It has been a privilege to lead Intervala through its formation and growth into a formidable full-service provider of integrated electronic solutions,” added Huber. “I’m very proud of what we have accomplished as a team and confident that Rob will lead Intervala to even greater heights. It has been an honor to be part of the exceptionally talented team here, and I look forward to seeing the new ways in which Intervala will apply its customer-focused culture to excel in what I see as a future of tremendous opportunity.”
MORRISVILLE, NC – Juki America – EAS Division, a global leader in automated assembly products and systems, is pleased to announce that Mitch DeCaire, a seasoned expert with over 30 years of experience in electronics manufacturing, has joined the company as the new Regional Sales Manager for the Midwest, Northwest, and Western Canada.
Mitch brings a wealth of knowledge and expertise, having held pivotal roles at Cogiscan, Siemens EAS, Universal Instruments, Vansco Electronics, and Nortel Networks. His extensive background in Business Development, Process Engineering, and Engineering Management has played a key role in driving factory automation, digitalization, and smart manufacturing solutions across the industry.
“Mitch’s deep technical expertise, strategic mindset, and dedication to customer success make him a perfect fit for Juki,” said Gregory Lefebvre, National Sales Manager, at Juki America – EAS Division. “His leadership will be instrumental in expanding our presence in key regions and strengthening our commitment to delivering high-quality, reliable SMT assembly equipment.”
Juki America is a global leader in Surface Mount Technology (SMT) assembly equipment, known for its reliability, cost efficiency, and world-class customer support. With a strong focus on Industry 4.0, IIoT, machine connectivity, and process optimization, Juki continues to empower electronics manufacturers with cutting-edge automation and traceability solutions.
As Mitch steps into his new role, Juki looks forward to the innovative strategies and customer-focused growth he will bring to the team.
For more information about Juki America – EAS Division, visit www.jukiamericas.com
SAN JOSE, CA – Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, proudly announces new partnerships by adding 15 new customers in FY24, setting the stage for growth in FY25 and beyond. These new partnerships span across both our RF Center of Excellence in Londonderry, NH, and our PCBA Center of Excellence in San Jose, CA.
“We are excited to grow with our new customers and strengthen our footprint in the highly regulated electronics manufacturing industry,” said Teh- Kuang Lung, President and CEO of Naprotek. “This growth reflects our commitment to delivering high-reliability and high-quality solutions and our ability to meet the diverse needs of our customers across multiple segments.”
Tim Filteau, COO of Naprotek, added, “Our team’s dedication to innovation and excellence have been key in attracting new customers and forming new partnerships. We look forward to continuing our growth trajectory and providing top-tier services to our customers.”
As Naprotek continues to forge ahead, our focus remains on fostering strong, collaborative partnerships with our customers. By leveraging our expertise and innovative capabilities, we aim to drive advancements in the electronics manufacturing industry and deliver exceptional value to our partners.
For more information about Naprotek and its high-reliability manufacturing services, please visit www.naprotek.com or contact our support team.
HYDERABAD, INDIA – Cyient DLM, an integrated partner for design-led manufacturing, has signed a production contract with Boeing Global Services (BGS) for precision-machined parts and assemblies, marking a key milestone in their partnership.
This precision machining project awarded to Cyient DLM by BGS highlights Cyient DLM's growing capabilities in delivering high-precision components to the aerospace sector.
Anthony Montalbano, CEO, Cyient DLM, said, "This contract with Boeing is a significant achievement for Cyient DLM, showcasing our advanced manufacturing capabilities and unwavering commitment to excellence. We are honoured to collaborate with Boeing, a global leader in aerospace, and we look forward to strengthening this relationship by consistently delivering products that meet the highest industry standards."
Cyient DLM's achievement underscores its position as a trusted partner in the Aerospace and Defense sector. The company is among the first AS9100C aerospace-certified electronic manufacturing facilities and the first in India to obtain the National Aerospace and Defense Contractors Accreditation Program (NADCAP) certification for Circuit Card Assembly (CCA).
With over 30 years of experience, Cyient DLM specializes in manufacturing prototypes, small-batch production, box builds, and complete sub-assemblies and assemblies involving precision machining and detailed integration. The company also excels in additive manufacturing (3D printing) for proof-of-concept designs, design verification, and functional testing.
SAN JOSE, CA – SHENMAO America, Inc. is proud to announce that its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure) certification for recycled content. This prestigious validation now includes auditing of social responsibility procedures.
Under its vision of becoming a resource-saving and environmentally friendly global leader in solder manufacturing, SHENMAO has prioritized recycling tin alloy as a core strategy in developing solder products and green energy solutions. This initiative not only enhances the company’s competitiveness but also reduces its carbon footprint and deepens its ESG (Environmental, Social, and Governance) efforts.
As part of its sustainability mission, SHENMAO has implemented resource recycling and waste management policies that align with national regulations and industry best practices. By integrating internal systems and urging group companies to optimize waste treatment, the company actively reduces environmental pollution risks while maximizing resource efficiency.
A series of SHENMAO’s solder materials—including Solder Paste, Solder Bar, Solder Wire, and BGA Solder Sphere—have successfully achieved UL validation for recycled content. These products contain a minimum of 80% recycled content, with the tin alloy sourced entirely from 100% recycled materials.
To ensure transparency and reliability, every step in SHENMAO’s recycling process undergoes rigorous auditing. The company has also made technical breakthroughs to ensure that the quality and performance of its recycled solder materials meet or exceed the standards of virgin materials. By controlling impurities in recycled tin alloy, SHENMAO guarantees that these materials perform at industry-leading levels with no significant difference from those made with virgin tin.
As the adoption of recycled tin continues to rise, SHENMAO is seeing growing market acceptance of its sustainable solder solutions. By prioritizing innovation, sustainability, and social responsibility, SHENMAO is setting a new standard for environmentally friendly manufacturing in the electronics industry.
For more information about SHENMAO’s sustainable solder solutions, visit www.SHENMAO.com
BLAUBEUREN, GERMANY – Since 2002, productronica in China has been one of the most important events in Asia. This year, the trade fair once again offers the opportunity to exchange ideas with international experts, attend specialised lectures, make business contacts and find out about the latest innovations across the entire electronics production value chain. Rehm Thermal Systems will also be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
In an increasingly competitive environment, electronics manufacturers must continuously adapt and improve their processes to remain competitive: the growing demand for reliable and powerful electronics means that durable and stable solder connections are becoming increasingly important. In addition, production costs are rising significantly due to higher prices for raw materials or electricity, so companies are constantly looking for ways to optimise costs.
Rehm Thermal Systems has responded to these developments and driven forward the further development of systems in areas such as convection soldering, condensation soldering, coating and dispensing: at booth E4.4518, the Rehm experts will be demonstrating the wide range of applications for the dispensing and coating system live at the Protecto.
They will also be providing information on convection soldering under vacuum with the VisionXP+ Vac for greater process reliability and on more economical vapour phase soldering with the Condenso Series thanks to the integrated closed-loop system.
High-quality Convection Soldering with the VisionXP+ Vac
Vacuum soldering has proven to be particularly suitable for high-quality solder joints with very few voids: with the VisionXP+ Vac convection soldering system from Rehm Thermal Systems, pores, gas inclusions and voids can be reliably removed directly after the soldering process while the solder is still in an optimally melted state. Time-consuming post-processing of the assemblies using an external vacuum system is therefore no longer necessary. The VisionXP+ Vac is not only characterized by high process stability, but it also impresses with reduced operating costs thanks to the switch to EC motors (energy savings of around 30 percent).
Resource-saving Vapour Phase Soldering with the Condenso Series
With the closed-loop system for lower production costs thanks to lower Galden® consumption, minimal maintenance and fewer production errors, Rehm Thermal Systems has found a future-proof solution for more economical vapour phase soldering: after soldering, the vacuum and/or cooling process starts. At the same time, the process gas is extracted and purified. A vacuum is created during extraction, which guarantees rapid drying of the solder and process chamber, thus minimising losses when the products are discharged. The extracted Galden® is filtered and cleaned of impurities using granules. This allows approx. 99.9 percent of the medium to be recovered. The purified liquid is stored in a container at room temperature and made available for further processes. This means that no evaporation and energy losses occur. The hermetic sealing of the process chamber (also a vacuum chamber) also prevents evaporation losses during soldering.
Flexible Coating and Dispensing Options with the Protecto Series
Conformal coating has become an integral part of modern manufacturing, as the protective coating is used to reliably protect electronic assemblies from aggressive environmental influences. With the Protecto Series, Rehm Thermal Systems offers you the opportunity to react quickly to market changes and individual customer requirements thanks to a wide range of possible applications: this system is not only used for automated coating, but also for bonding, sealing and fixing. In addition, up to four different materials can be applied directly "on the fly" using the various applicators.
The systems can be operated using the ViCON software, which fulfils all the requirements of modern, networked and, above all, future-oriented electronics production: the ViCON combines tried-and-tested software tools, such as clear product management and process locking, with new possibilities in mobile applications in the form of the ViCON App and ViCON Connect – in an attractive design and with intuitive touch operation.
We look forward to your visit and the opportunity to talk to you personally about the individual challenges of your manufacturing or production and to answer your questions.
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