POOLE, UK – CEEI SRL Industrial Electronics, a leading provider of electronic board and system design for industrial and professional applications, continues to advance its manufacturing capabilities with Europlacer’s high- performance pick-and-place solutions. With a focus on flexibility, precision, and efficiency, Europlacer has played a key role in helping CEEI streamline operations and meet growing customer demands.

For over 40 years, CEEI has been delivering high-quality products while maintaining agility in production processes. As customer expectations for shorter lead times and high- mix manufacturing continue to rise, CEEI sought a partner capable of supporting scalable and adaptable production.

Europlacer emerged as the ideal choice, offering advanced SMT placement solutions tailored to CEEI’s needs.

“In 2016, we were experiencing rapid growth and needed a technology partner that could support our expansion,” said Giorgio Mazzolatti, CEEI SRL. “With the introduction of Europlacer’s iineo2 machine, we immediately saw improvements in quality and efficiency. Within a year, our productivity increased by 20%, and our delivery times were reduced by 15-20%, allowing us to better serve our customers.”

Europlacer’s technology has allowed CEEI to minimize downtime through offline production setup capabilities, ensuring seamless transitions between production runs. The intuitive programming interface has also streamlined workflows, reducing setup time and enhancing operational efficiency.

The versatility of Europlacer’s SMT solutions has been particularly beneficial, enabling CEEI to manage both large-scale production and rapid prototyping with ease. The ii-tab mobile solution has further optimized efficiency, providing real-time data for workflow improvements, production monitoring, and enhanced traceability.

“As our business continued to grow, we needed a solution that would support increasing production volumes without sacrificing flexibility,” added Giorgio Mazzolatti. “The decision to invest in Europlacer’s Atom3 machine was a natural next step. Its speed and precision have allowed us to expand high-volume production capabilities, meeting our customers’ evolving needs with greater agility.”

Beyond the technology, CEEI values the strong relationship it has built with Europlacer. From initial implementation to ongoing technical support, Europlacer has provided responsive service and expert guidance, ensuring seamless integration and long-term success.

“The Europlacer team’s professionalism and commitment to our success have been outstanding,” Giorgio Mazzolatti noted. “They go beyond simply resolving issues—they actively work with us to optimize processes and improve operations. This level of support has been a game-changer for us.”

Looking ahead, CEEI sees Europlacer as a vital partner in its continued growth, particularly in prototyping and high-mix, low-volume production. As the market demands greater speed and precision, CEEI is confident that Europlacer’s cutting-edge solutions will continue to drive success.

For more information about Europlacer and its SMT solutions, visit www.europlacer.com 

NASHVILLE – Magnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will present the technical paper “Methods used to Qualify Soldering and Cleaning Materials and Processes” on Tuesday, March 18 at the 2025 IPC APEX EXPO Technical Conference.

Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean flux residues, partially cleaned flux residues, and wash fluids not fully rinsed during cleaning. These contaminants interact with their environment leading to the deterioration of components, ultimately causing system malfunctions.

Testing methodologies, such as Surface Insulation Resistance (SIR), Ion Chromatography (IC), and C3 testing, are designed to identify potential failure points and ensure electronic systems can withstand the challenges of different environments. Bixenman’s research paper will provide insight into the effects of process contamination and the use of these methods to qualify the assembly process.

Bixenman’s presentation, “Methods used to Qualify Soldering and Cleaning Materials and Processes” will be one of four presentations during the “Quality and Reliability 2: Ionic Process Residues and PCB Assembly Humidity Robustness” session.

Additional presentations during the session are: “From the Corrosion to Short Circuiting in Electronics: Investigation of The Detrimental Dendrite Development” presented by Dr. Kapil Kumar Gupta of Technical University of Denmark, “Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness” presented by Dr. Rajan Ambat of Technical University of Denmark, and “Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics” presented by Dr. Anish Rao Lakkaraju of the Center for Electronic Corrosion (CELCORR).

For more information about the technical conference or to register to attend, visit the official website of IPC APEX 2025. For more information about Magnalytix, click here.

CHELMSFORD, MA – VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced plans to exhibit at the 2025 IPC APEX EXPO, taking place March 18-20, 2025 at the Anaheim Convention Center. At Booth #2513, attendees will experience firsthand the Summit 2200i Rework System, XQuik III Component Counter, and Apogee 130 X-ray Inspection System, each designed to enhance precision, automation, and efficiency in electronics manufacturing.

Summit 2200i: Precision and Automation Unleashed

The Summit 2200i is a state-of-the-art, fully automatic rework system designed for medium to large-sized Surface Mount Device (SMD) assemblies. With the capability to handle boards up to 22” x 30” and components as small as 01005, the Summit 2200i sets a new industry standard in precision and automation. Key features include:

• Automatic alignment for components up to 100mm square, reducing operator intervention.
• Advanced thermal control for optimal soldering and rework precision.
• Enhanced process automation, minimizing manual handling and improving repeatability.

The Summit 2200i is built to address the increasing demand for high-precision, hands-free rework solutions, making it an essential tool for modern electronics assembly processes.

Apogee 130: High-Resolution X-ray Inspection at an Affordable Price

The Apogee 130 delivers superior 2D & 2.5D X-ray imaging for a variety of applications, including PCBs, electrical components, medical devices, counterfeit component screening, and wire harness inspections. Key advantages include:

• High-clarity imaging with advanced defect detection for BGA, QFN, PTH, and solder voids.
• New Vi5 software integration, featuring real-time visualization, auto contrast, and advanced defect enhancement tools.
• User-friendly GUI for intuitive operation, reducing training time and increasing efficiency.

With maintenance-free X-ray components and a long service life, the Apogee 130 provides high-resolution, automated X-ray inspection at a cost-effective price point, making it a valuable addition to production and quality control environments.

XQuik III: The Smart Factory Component Counter

The XQuik III is a fast, accurate, and intelligent X-ray counting system engineered for modern electronics manufacturing. With a cycle time of less than 10 seconds, the XQuik III eliminates the inefficiencies of slow, manual inventory counting—an issue made even more critical amid ongoing component shortages that can lead to line-down situations. Key benefits of the XQuik III include:

• Industry-leading count accuracy of over 99.8% using AI-driven automatic component recognition.
• Fast cycle times: Counts both a large reel and four small reels in under 10 seconds, including automatic barcode scanning.
• Push-to-start operator experience for simple, efficient use.
• Flexible MES interface for seamless communication with any inventory control system.
• Pass-through automation capability for smart factory integration.

VJ Electronix invites attendees to visit Booth #2513 at the 2025 IPC APEX EXPO to explore how these cutting-edge solutions can enhance precision, efficiency, and automation in electronics manufacturing. For more information or to schedule a demo, visit www.vjelectronix.com 

TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will host an insightful webinar titled "Importance of Mechanical Stress Measurement for PCB Assembly and Mounting Process" on Wednesday, March 5, 2025 at 1:00 PM EST. The event will be presented by James Hara of Kyowa Americas, an expert in strain gage measurement and the effects of mechanical stress on PCB assembly processes.

Registration is now open! Join us for this informative session by registering here: Webinar Registration Link.

This webinar is part of Seika Machinery’s ongoing Seika Webinar Series, in collaboration with Kyowa Americas, and is designed to provide valuable insights into the critical role of mechanical stress evaluation in ensuring the durability and reliability of printed circuit boards (PCBs).

PCBs used in automotive, commercial vehicle, and consumer electronics applications are exposed to harsh environments that can affect their long-term reliability. Even the smallest crack in a PCB can lead to catastrophic system failure, making it essential for manufacturers to assess and mitigate mechanical stress and strain during the design and assembly processes.

James Hara will discuss the importance of evaluating mechanical strain in PCBs and provide an overview of strain gage methodology. This approach helps identify areas of high stress concentration, which can potentially lead to board breakage or failure. By examining real-world case studies, Hara will demonstrate how this technique can be used to enhance PCB durability and improve the overall engineering process.

This session is highly recommended for professionals in the PCB manufacturing industry, including engineers, designers, and quality control teams, looking to better understand the importance of mechanical stress measurement and how it can impact the success of their PCB assembly and mounting processes.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com