CRANSTON, RI — February 2025 — Federal Electronics, a leader in providing advanced electronic manufacturing services, is proud to introduce its state-of-the-art Class 10,000 cleanroom at its Cranston facility, further strengthening its reputation for exceptional quality and reliability in critical applications. This investment highlights the company’s dedication to supporting OEM’s high reliability applications with cutting-edge manufacturing solutions that meet the strictest industry standards.

The new ISO 7-certified cleanroom ensures a meticulously controlled environment, limiting airborne particles to fewer than 10,000 particles per cubic meter, making it ideal for the production of highly sensitive and complex electronic assemblies. Equipped with HEPA filtration systems that capture 99.97% of airborne contaminants, continuous environmental monitoring, and strict safety protocols, the cleanroom enhances Federal Electronics' ability to manufacture mission-critical products with the highest precision and consistency.

“Our new Class 10,000 cleanroom is a major milestone in our ongoing commitment to providing customers with world-class manufacturing solutions,” said Ed Evangelista, President, Federal Electronics. “This facility expands our capabilities, ensuring that we continue to meet the needs of industries that require the highest levels of quality and process control.”

Federal Electronics welcomes customers and industry partners to visit its new cleanroom and explore how its vertically integrated manufacturing model and U.S./Mexico footprint provide exceptional value and performance for high-complexity, highly engineered, and highly regulated products.

For more information about Federal Electronics and its new cleanroom capabilities, visit www.federalelec.com or contact sales@federalelec.com.

About Federal Electronics

Established in 1961, Federal Electronics is a leading provider of advanced Electronics Manufacturing Services (EMS), specializing in complex, mission-critical products for industries such as defense, industrial, and medical.

With over six decades of experience, the company offers comprehensive solutions that encompass engineering, supply chain management, and manufacturing services tailored to meet the unique challenges of high reliability markets.

SANTA CLARA, CA ― February 2025 ― Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to offer innovative, scalable, and repeatable solutions from its state-of-the-art facility located in the heart of Silicon Valley. Since its founding in 1996, Absolute EMS has grown from its roots in the medical industry to expand its services across a diverse range of verticals, including Medical, Military, AI/High Performance Computing, Industrial, Networking, and Engineering sectors.

As a leader in controlled manufacturing processes, Absolute EMS specializes in providing flexible and efficient support for new product introductions (NPI), research and development (R&D), and low to mid-volume production. The company’s advanced equipment lines are designed to support the industry’s growing demands for miniaturization, speed, and flexibility. Absolute EMS can quickly ramp from prototype manufacturing of just five units to full-scale production of 100k units, offering unmatched value to clients in need of reliable, Made-in-America PCB assembly manufacturing.

Whether your company is in the process of onshoring or seeking a trusted partner for sophisticated manufacturing needs, Absolute EMS is ready to deliver. With a focus on building long-term relationships and providing high-quality support, Absolute EMS offers both the capabilities and expertise to meet the complex demands of its clients.

"We provide not only the technical capabilities but also the reliability and support our clients need to bring their products to market successfully," said Doug Dow, Absolute EMS COO. "Our clients can be confident that they’re working with a partner who is committed to excellence at every stage of production."

Absolute EMS is proud to operate a 20,000 square foot, manufacturing 4.0 facility that combines cutting-edge technology with an emphasis on lean processes and continuous improvement. With certifications including ISO 13485, AS9001D, and ISO 9001, Absolute EMS continues to lead the charge in providing high-precision electronics manufacturing solutions (EMS).

For more information about Absolute EMS, visit www.absolute-ems.com.

About Absolute EMS

Absolute EMS, located in the heart of Silicon Valley, offers 6-time award-winning manufacturing services in a state-of-the-art, high-technology EMS facility. Founded in 1996, Absolute EMS originally serviced the medical industry, thus their focus on controlled electronics manufacturing that is scalable and repeatable. The Absolute EMS focused verticals are Medical, Military, Industrial, Networking, Aerospace, high performance computing, AI and Engineering. Learn more by visiting http://www.absolute-ems.com.

Carlsbad, CA, USA – 4 February 2025 - Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, has been honored with the 2024 Jabil Best Strategic Supplier Award, underscoring Nordson’s essential role in enabling Jabil, a global leader in manufacturing services, to achieve operational excellence and deliver exceptional value across its supply chain.

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Dr. Jennie Hwang, Chair of the AI Committee of National Academies/DoD AI study, Chair of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course. A pioneer and long-standing leader in SMT manufacturing and lead-free implementation brings deep knowledge and broad experiences to the high-reliability electronics course through both hands-on and advisory capacities in commercial as well as military applications. Her comprehensive and discerning knowledge has solved the toughest reliability and production issues for Class 3 and mission-critical and safety-centric electronics. Both courses provide working knowledge and pragmatic perspectives to all concerned about product reliability under harsh environments or interested in acquiring holistic perspectives of the present and future of AI.

Sunday, March 16– 1:30 PM -= 4:30 PM

PD14: “Artificial Intelligence Era – Opportunities, Challenges, Possibilities”

As moving into the Artificial Intelligence (AI) era, the new AI tools and platforms are remaking our daily lives and every aspect of the workplace including design, research, engineering, manufacturing and management across all industries - from semiconductor and printed circuit board design to life sciences and new material design. Even not being an AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. This course will bring an up-to-date and panoramic overview of AI to spur innovative ideas and inspire new vistas to timely capitalize the sound benefits of AI to maximize on-job efficiency and effectiveness as well as business profitability and productivity. The recent emergence of ChatGPT and Generative AI makes use cases and “possible” future more crucial to the on-job performance.

The ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as a virtuous tool. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course maps out AI landscape including the current and future of AI development/deployment, demystifies prevalent notions, and outlines the prerequisite to win the “AI game.” The key components behind AI technology include machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, Large Language Model (LLM), AI prompt engineering, AI with justified confidence/trust, industry use-cases will be highlighted along with tips and recommendations.

Topics:

• Backdrop & diverse perspectives

• Current state of AI – global race, AI chips

• AI – justified confidence/trust

• AI hierarchy – ML, DL, NN, digital twin, IoT & use cases

• Generative AI, ChatGPT-4 (+) – nuggets, tips

• Prompt engineering – techniques, tips, and recommendations

• Enterprise opportunities – examples

• AI on jobs – impact, tips

• Data – quality, management

• Edge AI, private AI

• Global leaders & competitiveness – examples, risk-mitigation

• AGI - Artificial General Intelligence

• Brain, mind  “intelligence”

• Future of AI – near, far

• Concluding remarks

Sunday, March 16 – 9:00AM -12:00PM

PD7: “High Reliability Electronics for Harsh Environments”

The electronics/microelectronics industry increasingly requires high-reliability products that are capable of consistently delivering reliable performance under harsh environments. This course dissects what it takes to perform in harsh environments and the rationale behind it including the most critical and discerning factors, and offers ten (10) imperatives to ensure product reliability under harsh environments. Key players in PCB assemblies including components, PCB, solder joint, and manufacturing process will be outlined. The causes and prevention of likely product failure categories and failures induced by time, voltage, and external environments, such as intermetallic compounds, electro-migration, creep corrosion, tin whiskers will be highlighted. The backward compatibility of Pb-free BGA solder-ball and solder paste, the heightened impact of solder joint voids, and the relative ranking among new solder alloys including “low-temperature solder” will be summarized. To design and produce reliable products under harsh environments, the course is created to provide a holistic approach to eschew knowns and unknowns of likely failure modes by fusing test data, real-world performance, and scientific, engineering, and manufacturing principles.

Topics

1. Reliability - philosophy, principle, practice, business factors

2. Reliability vs. quality vs. manufacturability

3. PCB assembly reliability – role of solder joint, component, PCB, manufacturing process

4. Reliability strategy – preventing likely failure phenomena and mechanisms

5. Prevent likely failure categories – knowns, unknowns

6. Integrity of PCB – factors, prevention of vulnerable areas, role of surface finish

7. Solder joint reliability – factors, relative fatigue-creep performance ranking of solder alloys

8. Backward compatibility – BGA solder ball and solder paste (lead- and lead-free)

9. Effects of solder mask

10. Effects of manufacturing processes

11. Intermetallic compounds (IMCs)– factors, prevention of “unwanted” IMCs

12. Tin whisker – factors, relative effectiveness of mitigating measures

13. Electro-migration, creep corrosion, dendritic growth – causes, prevention

14. Solder joint voids – effects, criteria, mitigation

15. Cleanliness – how clean is “clean?”

16. Other considerations

17. Reliability tests – methodologies, testing parameters vs. data vs. conclusions

18. System life-prediction modeling requirements – parameters, artificial intelligence-enabled

19. Ten (10) imperatives to ensure reliability

20. Concluding remarks

International Hall of Famer of Women in Technology, Dr. Jennie S. Hwang brings deep knowledge and comprehensive experiences to this course through both hands-on and advisory capacities. She has provided solutions to reportedly the most challenging issues in production yield and high-reliability products, covering commercial and military applications. The author and co-author of ten (10) internationally-used textbooks and 750+ publications; a speaker at innumerable international and national events; on the Board of NYSE Fortune 500 companies and on various civic, government, and university boards and committees (e.g., DoD - Globalization Committee, DoD - Forecasting Future Disruptive Technologies Committee, National Materials & Manufacturing Board, Board of Army Science and Technology, and Technical Assessment Board of NIST). She has served as Chair of the Artificial Intelligence Committee of National Academies; Chair of the National Artificial Intelligence Institute of NSF; Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NS; Chair of the National Laboratory Assessment Board; Chair of Assessment Board of Army Research Laboratory; Chair of Assessment Board of Army Engineering Centers. Having received numerous honors and awards including International Hall of Fame of Women in Technology, National Academy of Engineering inductee, and named R&D-Stars-to-Watch, her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry & Liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., among others, and CEO of International Electronic Materials Corp. She is also an invited distinguished adj. professor of engineering School of Case Western Reserve University and serves on the University’s Board of Trustees. Further Info: www.JennieHwang.