WATERBURY, CT — As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next- generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.

MacDermid Alpha’s technology supply chain is fully optimized with over 3,000 employees worldwide, servicing customers in over 50 countries with local and regional services, a rapid delivery time, lower manufacturing costs, and a seamless ‘start to finish’ experience. Combining strength in critical markets such as 5G, automotive and EV, military, aerospace, medical devices, and consumer goods, with world-class technologies and unrivaled, 24/7 technical support, MacDermid Alpha’s family of brands includes Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone.

Julia Murray, Senior Vice President of Marketing at MacDermid Alpha, comments, “We are in a unique position to offer the electronics community a complete ‘start to finish’ technology roadmap with some of the most advanced circuitry, assembly, and semiconductor technologies on the market. We are helping our customers redefine what’s possible and leverage capabilities to the next level. This is something we’re very excited about and we will be showcasing solutions from our 3 cornerstone divisions during the show.”

MacDermid Alpha will also present 4 separate technical papers on lightweight materials, solder alloy performance in automotives following vibration tests, surface finish performance for next- generation technology and assess the performance of assemblies coated with state-of-the-art materials as opposed to standard conformal coatings used by manufacturers. Each technical paper will provide audiences with groundbreaking findings that unlock, explore and unveil new test data.

Visit the MacDermid Alpha team at booth 1933 to find out how to power up complete electronics interconnection solutions. For further information, please visit www.macdermidalpha.com

AUSTIN, TX ― Cetec ERP, a leading cloud ERP software provider, is pleased to announce that Jordan Jolly, Director of Sales and Implementation, will host a round table during the Wiring Harness Manufacturer’s Association (WHMA) Conference. The event is scheduled to take place Feb. 14-16, 2023 in Albuquerque, New Mexico.

Jolly will host the round table discussion entitled, ‘Making ERP Less Evil: An ERP Best Practices on Wednesday, Feb. 15th . ERP systems might be described as a "necessary evil". If they are necessary, in what ways do you think they could be made less evil? What lessons have you learned over the years?

Jolly has been directing ERP implementations for the electronics industry for more than 10 years, and has seen numerous different situations, successes and failures. He would love to share those experiences with a round table and potentially learn from others’ experiences as well.

Over the past 30 years, the WHMA Annual Wire Harness Conference has become one of few investments that give an opportunity to learn, grow, share, and discover new approaches to many aspects of the wire harness industry. The conference features a number of timely presentations on topics important to wire harness manufacturers, OEMs and suppliers. It also includes peer-to-peer networking, best-practices roundtables, a technical education workshop and an Exhibit Hall with industry leading suppliers. It’s a conference you do not want to miss! Cetec ERP’s leading-edge system helps customers handle stringent regulatory requirements and track dynamic production environments, all from a single, friendly web interface. All modules, support, maintenance and upgrades are included in the monthly subscription.

To learn more about Cetec ERP, visit http://cetecerp.com/ 

HELSINKI — Incap Estonia upgraded its two current SMT production lines and added a third SMT line to its factory in Kuressaare. The EUR 1.35 million investment increases the factory’s overall SMT production capacity by more than 50%.

According to Margus Jakobson, the Interim Managing Director of Incap Estonia, the investment in SMT (surface-mount technology) supports the company’s rapid growth and flexibility in customer service. New electronics equipment in the Kuressaare factory was acquired from SMT Renting on a long-term lease agreement.

“We decided to upgrade two existing production lines to make the production process faster. The third 30-meter long line will help to increase our SMT production capacity and increase it by more than 50%,” Jakobson explained. The new production machinery will contribute significantly to the production of the most important part of electronic devices.

Incap Estonia is part of Incap Corporation, which is an international contract manufacturer. Electronics manufactured by Incap Estonia can be found for example in smart meters, in light electric vehicles on the streets, in smart led lights in different regions in Estonia as well as in the machinery of the world’s most famous maritime company.

CLINTON, NY — Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature:

• InFORMS® are reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• Heat-Spring® is a soft metal alloy (SMA) thermal interface material (TIM) that reduces thermal resistance and enhances cooling by utilizing two key properties of indium metal—superior thermal conductivity and malleability. As added benefits, indium metal will not dissolve in immersion fluids and is considered an environmentally friendly TIM because it can be re-used, reclaimed, and re-formed.
• Indium Corporation’s new GalliTHERM™ family of liquid metal pastes (LMPs) is a true liquid metal-based TIM solution, based on proprietary technologies, that can handle challenging heat dissipation issues and maintain long-term reliability. Unlike traditional gallium-based liquid metals which are prone to pump-out and typically require specialized spreading processes, LMPs offer higher viscosity and predictable spreading characteristics for scalable high-volume applications, with a reduced risk of pump-out, at a lower total cost. LMPs are fully automation-ready in jetting, dispensing, and printing applications. They require no backside metallization and exhibit superior surface wettability resulting in extremely low contact resistance and offer stable thermal impedance through accelerated aging tests.
• QuickSinter® is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
• Durafuse™ LT is an award-winning low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. It delivers improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials and helps reduce energy consumption by 15%, depending on process.
• Durafuse™ HT features a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse™ HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
• Indium Corporation’s Au-based precision die-attach (PDA) preforms—also available in off-eutectic formulations—offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision.