CAMBRIDGE, UK – Integrating multiple functionalities within a single entity promises simpler, more efficient devices without compromising capability. Smartphones are a great example, with maps, diaries, phones, cameras, games consoles, and more integrated into a single, compact device. However, the smartphone itself is arguably a masterpiece of packaging, containing many different components from different suppliers that are mounted onto a chassis.

What if, rather than assembling numerous subsidiary components and ensuring electrical connectivity, the functionality was integrated into the object itself? This is the promise of ‘3D electronics’, where the boundaries between mechanical and electrical design fade away and components have the electronic functionality embedded within them. This approach can be applied to many length scales, with electronic functionality in the form of conductive inks and components are applied onto the surface of 3D objects, termed ‘partially additive’, or incorporated internally (termed ‘fully additive’, akin to 3D printing with electronics included).

In-mold electronics (IME) is a third approach to producing embedded electronics, generally in the form of smart surfaces with integrated lighting and capacitive touch sensors. With IME, conductive inks are printed and components are optionally mounted onto a flat surface that is subsequently thermoformed and enclosed via injection molding.

Benefits and Challenges

Embedding electronic functionality within an enclosed part via fully additive electronics or IME offers a compelling value proposition: fewer parts, fewer connections, simpler supply chains, minimal assembly, lower weight, and improved sustainability. The ability to access these benefits with established manufacturing methods such as screen printing, thermoforming and injection molding means that IME has received extensive interest from OEMs across multiple sectors and from materials suppliers. But is there a downside to embedding electronic functionality? After all, functional foil bonding, a competing approach to IME with less integration that also enables backlit touch-sensitive interfaces, has gained considerable commercial traction and is deployed in multiple vehicles today.

Arguably the main challenge for embedded electronics methods such as IME is that the product of individual yields determines the overall production yield. As such, the yield of each constituent process, including those that are purely decorative, must be extremely high – if there is a problem with any process step, the entire part must be discarded. IDTechEx has been told that the biggest yield concerns for functional surfaces are associated with producing a glossy black decorative exterior rather than the electronics themselves.

The second challenge associated with integrating electronic functionality is reconfiguring supply chains. If the separate components are assembled, then each part and hence supplier can be changed independently. In contrast, if all the components are integrated within a single part via IME or fully additive electronics, then mutual compatibility must be ensured, reducing the ease of switching suppliers and potentially increasing component prices.

When Is Functionality Integration Worthwhile?

Determining when the functionality integration offered by IME is most compelling requires consideration of two parameters: degree of integration and production volume. Achieving the requisite high yields and reconfiguring the supply chain imposes high initial costs but can reduce variable costs since less material is used and less assembly is required. Furthermore, greater integration, such as embedding integrated circuits (ICs) within IME parts to provide processing capability, further reduces material and assembly costs.

As such, IDTechEx suggests that embedded electronics, either IME or fully additive, will have a higher value proposition as both production volume and the extent of functionality integration increase.

Additional Information

IDTechEx’s reports “3D Electronics/Additive Electronics 2022-2032” and “In-mold Electronics 2023-2033” provide comprehensive insight into these emerging manufacturing methodologies. Drawing on interviews with companies and conference visits, both reports evaluate the competing technical processes, material requirements and applications. Each report includes 10-year market forecasts segmented by technology and application sector, expressed as both revenue and area/volume.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Rocky Mountains Expo taking place on March 10th at the Coors Field in Denver, Colorado. AIM will highlight their newest halogen-free no clean solder paste, H10.

H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.

H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.

To discover all of AIM’s products and services, visit the company at the SMTA Rocky Mountains Expo on March 10th for more information and to speak with one of AIM’s knowledgeable staff members, or visit www.aimsolder.com

JASPER, IN – Kimball Electronics, Inc. (Nasdaq: KE) today announced the release of its 2022 Environmental, Social & Governance (ESG) Report, themed "Poised to Make an Impact," highlighting the Company’s ongoing efforts to operate sustainably and responsibly in calendar year 2022.

The Company’s annual ESG report provides an in-depth analysis of Kimball Electronics’ ESG initiatives, including the many examples of how the Company demonstrates its purpose of Creating Quality for Life in its communities through positive environmental and societal impacts and projects. Some of the achievements for calendar year 2022 included the following:

• A 36% reduction in greenhouse gas emissions since 2014
• A 26% reduction in air emissions since 2014
• Donations of over $330,000 in time and money toward worthy causes worldwide
• The adoption of globally recognized ESG reporting standards

"We want our reporting to show how we proactively address challenges both in our business and to our stakeholders, and that we recognize the connection between significant ESG issues and the long-term value we deliver to Share Owners," stated Don Charron, in the report’s CEO Message to stakeholders.

Mr. Charron, who retired February 28, 2023, and was succeeded by Ric Phillips, penned the ESG message as one of his last public letters as the Company’s top executive, a fitting farewell since the report covers happenings during his last full calendar year of leadership.

The latest report also demonstrates both the Company’s decision to strengthen its ESG disclosures and the importance of ESG in its business strategy and global operations.

"This year represents a milestone for Kimball Electronics," said Doug Hass, Chief Legal & Compliance Officer. "The standardization of our ESG data disclosures helps us to build trust with those who use our data to make more informed decisions about us. All of these sustainability efforts help us meet our stakeholder needs, regulatory requirements, and DEI&B goals; contribute to the prosperity and quality of life of our global community; and deliver long-term, sustainable profits for our Share Owners."

The full version of the 2022 ESG Report at www.kimballelectronics.com/esg includes ESG reporting that complies with the Sustainability Accounting Standards Board’s Electronic Manufacturing Services & Original Design Manufacturing standard and the Task Force on Climate-Related Financial Disclosures. It also documents how the Company’s ESG priorities align with and support the United Nations Global Compact’s Ten Principles and the UN Sustainable Development Goals. The Company will also make the 2022 ESG Report available in an interactive format.

SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced the appointment of Mark Evans as Chief Operating Officer (COO). With more than 34 years of industry expertise, Evans brings energy, enthusiasm and experience to Green Circuits’ operations and supply chain.

An industry veteran, Evans began his career at Flextronics in 1989 as a Process Engineer, after studying Electrical Engineering at the University of Glamorgan in the UK. He went on to earn his BS in Business Management from the University of Phoenix, Kaizen Certification, Black Belt certification in both Lean and 6 Sigma.

Evans has experience overseeing production, quality, engineering, materials, HR and document control teams. In a previous role, he drove the revenue rate from $17 million to $100 million in just two years. Additionally, he has experience integrating major acquisitions.

Green Circuits specializes in quick-turn prototypes, new product development, and early-stage production to speed customer product launch. The spectrum of markets served includes defense, medical, robotics, automation, satellite, automotive and aerospace.

Green Circuits provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. For more information, visit www.greencircuits.com