CLINTON, NY – The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session.

Payne’s presentation, scheduled for 10:30–11 a.m. on Thursday, March 16, is titled “Processing and Reliability Testing of a Copper Pressure Sinter Paste for Use in High Power Module, Die- Attach Applications.” Power electronics are evolving to meet the high demands of new and emerging applications, such as e-Mobility/vehicle electrification. Pressure sintered silver is fast becoming the material of choice for die-attach due to the favorable material properties and proven reliability. This presentation will introduce a copper sinter paste that can achieve consistently high shear strengths (~40MPa) when sintered with 15–20MPa of pressure. The impact of process conditions will be examined, plus reliability testing.

In addition, Dr. Mackie has been tapped to chair a special lunch session, “Words Matter: Clarity in Terminology Around Advanced Packaging is Needed Now More Than Ever.” As the ubiquity of semiconductor chips in our daily lives has become increasingly apparent, the interconnection and protection of the semiconductor chip (IPSC, also known as “Packaging”) is also starting to enter the public consciousness. In order to enable clear communication to everyone—from layperson to senior engineer—the session will address the proliferation of sometimes confusing and overlapping terminologies (MCM, heterogeneous integration, advanced packaging, advanced assembly, and so on), how to differentiate these terms from each other, and what is necessitated for clear communications to all stakeholders.

Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Payne holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.

Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK.

SARASOTA, FL – WPI Vision, a division of World Precision Instruments, exhibit at the SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 28, 2023 at the Plano Event Center in Texas. The company will demonstrate its 3D SPECTASCOPE Enhanced Reality Microscope. The new 3D SPECTASCOPE brings a new dimension of accuracy and speed to electronic assembly and inspection throughout the PCBA Industry. With a range of new patent-pending technologies, 3D SPECTASCOPE sets a new precedent for workstation throughput.

Moving away from the traditional models of using multiple microscopes, the state-of-the-art 3D SpectaSCOPE is a fully digital, three-dimensional viewer. It offers a variable working distance, wide panning, large depth of field and self-focusing zoom to help decrease time spent in the assembly and inspection process, and increase the accuracy of your circuit board assembly.

For the first time, the 3D SPECTASCOPE has increased return on investment (ROI) by solving some of the problems in the PCBA process. With patent-pending technology and intuitive copyrighted software, the 3D SpectaSCOPE inspection microscope utilizes enhanced reality screen technology with high resolution cameras.

The 3D SpectaSCOPE lets users increase throughput while achieving greater accuracy at the highest detail. The ergonomic 3D inspection microscope features an incredible working distance of 300 mm, automatic self-focusing, integrated image capture and true 3-dimensional viewing. The 3D SpectaSCOPE is optimal for rework, through-hole assembly and inspections, and it is available in multiple configurations.

Reduce time and errors and increase ROI by adding the 3D SpectaSCOPE into your inspection process. Available with a free 14-day try before you buy, 3D SPECTASCOPE can be tested out to prove its effectiveness on your inspection bench. For more information, visit www.wpiinc.com/vision.

WASHINGTON – U.S. Sen. Mark R. Warner (D-VA), Chairman of the Senate Select Committee on Intelligence, issued a statement after the Department of Commerce released the first Notice of Funding Opportunity (NOFO) for CHIPS Act incentives, welcoming the announcement:

“The projects that will be made possible by the CHIPS Act will strengthen our national security and create good-paying manufacturing jobs here in the United States. With limited funding available, I urge the Department of Commerce to be strategic in selecting projects in order to ensure that funding advances U.S. economic and national security objectives.”

Nearly everything that has an “on” switch – from cars to phones to washing machines to ATMs to electric toothbrushes – contains a semiconductor, but just 12 percent of these ‘chips’ are currently made in America. The CHIPS and Science Act includes $52 billion in funding championed by Sen. Warner to manufacture chips here on American soil – a move that will increase economic and national security and help America compete against countries like China for the technology of the future.

Sen. Warner, co-chair of the Senate Cybersecurity Caucus and former technology entrepreneur, has long sounded the alarm about the importance of investing in domestic semiconductor manufacturing. Sen. Warner first introduced the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act in June 2020 along with Sen. John Cornyn (R-TX).

MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototype development and contract PCB assembly, announces Gina Ploeg has been added to the STI Team as SMT Assembly Technician.

Ploeg brings with her 14 years of experience in electronics assembly and manufacturing. She will be a tremendous asset to the STI Team using her experience & knowledge for the Engineering Services Division.