Circuits Assembly Online Magazine - Current

Press Releases

BLAUBEUREN, GERMANY – When productronica China opens its doors once more in Shanghai from 13 to 15 April 2023, Rehm Thermal Systems – an expert in thermal system solutions and active on the Chinese market for over 15 years – will also be presenting the highlights of its latest product portfolio. As the leading platform for innovative electronics production, the international trade fair is one of the most important events of its kind throughout the entire Asian region.

At the company stand in Hall N4, Stand Number 4518 of the Shanghai New International Expo Centre (SNIEC), Rehm will be presenting the VisionXP+ convection soldering system with vacuum chamber, the Condenso condensation soldering system, the Nexus contact soldering system and the Protecto dispensing and coating system this year.

The convection soldering systems belonging to the Vision series are efficient, powerful and – depending on the respective version – suitable for different batch sizes in the automotive, consumer electronics or power electronics sectors. The VXP+ with vacuum chamber, which Rehm will be exhibiting at productronica, is the “best-in-class” reflow convection soldering system from the manufacturer based in the southern German town of Blaubeuren, and is not only characterised by increased process stability, but also greater energy efficiency, reduced emissions and operating costs, all thanks to integrated EC motors. A separate vacuum module enables convection soldering processes with negative pressure in just one process: Pores, gas pockets and voids are reliably removed directly after the soldering process. There is no need for the assembly’s time-consuming processing by an external vacuum system; instead, the workpieces are transferred from the peak zones directly into the vacuum process. The high- end system also offers effective residue management by means of pyrolysis in the preheating zone, as well as minimal downtimes, low maintenance and intelligent traceability solutions.

In reflow condensation soldering or vapour phase soldering, the soldering process is carried out with the aid of hot steam. As the heat transfer is up to ten times higher than with convection soldering, the Condenso systems brought to you by Rehm are particularly suitable for large or high-mass boards. The systems of the Condenso series can be integrated into the most diverse production environments with the highest degree of process reliability – be it batch operation, inline connection or soldering in a continuous process. A vacuum option for void-free soldering also enables series production in power electronics. The system series highlights also include the patented injection process, which makes the soldering process individually controllable, or the control of the reflow profile reproducible – and thus ensures better control of the condensation phase.

With the Nexus contact soldering system, Rehm, in turn, promises the best results through reflow soldering processes with contact heat under vacuum. Suitable areas of application can be found in advanced packaging, and especially in the fields of power electronics, semiconductors and wafer technology, which are increasingly being used for railway operations, wind turbines, battery storage and, last but not least, in the automotive industry. Due to its minimal dimensions and high degree of user- friendliness, the system is particularly suitable for use in small to medium series production, and in the laboratory sector.

Optimal coating processes for high-quality electronics are available with the Protecto series from Rehm. The dispensing and coating systems protect electronic assemblies from aggressive environmental influences such as moisture, corrosion, chemicals, dust or vibration, and deliver safe, automated processes, as well as precise results in the application of a wide range of materials. Up to four simultaneously usable applicators give their users numerous options: In addition to dispensing, these include the ability to create freely definable, three-dimensional housing shapes by simple application, the immediate curing of UV varnishes and the casting or bonding of different materials.

With ViCON, Rehm offers a software solution for all systems being presented at productronica China. Tailored to a wide range of manufacturing processes, the plant software delivers an impressive performance with its intuitive operation, optimal process control, convenient product management and smooth connection to higher-level manufacturing management systems (MES).

NEWMAN LAKE, WA – Hentec Industries/RPS Automation announces that it is pleased to exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming SMTA Dallas Expo & Tech Forum to be held at the Plano Event Center, in Plano, Texas on March 28, 2023, and the SMTA Houston Expo & Tech Forum to be held at the Stafford Centre in Stafford, Texas on March 30, 2023.

At both SMTA events, Tom Baro, National Sales Manager for Hentec/RPS will be on-site to discuss how Hentec/RPS selective soldering, component lead tinning and solderability test equipment can improve the production quality of your printed circuit board assembly operation. The Vector and Valence selective soldering systems feature unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector and Valence are offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. All Vector and Valence systems are UL and CE certified and carry both a two-year system warranty and a four-year solder pot warranty.

Hentec/RPS Odyssey robotic hot solder dip machines are MIL spec complaint component lead tinning machines designed for gold removal, re-tinning applications, including high reliability and military applications as well as BGA de-balling. The Pulsar solderability test system features a dip-and-look qualitative test method to verify the solderability of the surface of electronic components and can be easily performed by shop floor personnel with minimal training.

DERRY, NH – StenTech® Inc., the leading multinational SMT Printing Solutions company, today announced the promotion of Raza Khan to Central Area Sales Manager. Khan has been managing StenTech’s Chicago facility for the past 14 years. He embodies a unique knowledge of the company and products that he will utilize in his technical sales role.

Khan graduated with a Bachelor of Science in Electronics and then began his career with StenTech in 2005. He initially joined StenTech as a machine operator and was soon promoted to CAD Designer. Backed by the insight of these roles, he was the natural choice to transition into management where he has excelled in supporting StenTech’s customers.

StenTech has been leading the way in stencil technology, being the first company to introduce Fiber Diode lasers into North America. With more than 30 experienced CAD designers, their strength is the support they provide in stencil modifications, materials and thickness recommendations. StenTech, incorporates sub-brands, PhotoStencil and ADT and offers a complete array of stencil technology, custom-tailored to suit your manufacturing requirements. They manufacture all types of stencils for the SMT industry.

To learn more, visit www.StenTech.com

Minneapolis, MN – The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.

The following four papers were selected for the “Best of Proceedings” award:

Andrew Mawer, NXP Semiconductors, for the paper “Assembly and Reliability of a Novel High Density Dual Row MaxQFP." Co-authors include Mollie Benson, X.S. Pang, Stephen Lee, J.Z. Yao, Alvin Youngblood, NXP Semiconductors.

Keith Sweatman, Nihon Superior Co., Ltd., for the paper “Effect of Strain Rate on the Ductility of Bismuth-Containing Solders." Co-authors include Tetsuro Nishimura, Nihon Superior Co., Ltd.; Stuart McDonald, Xiaozhou Ye, Qichao Hao, Beatrice Negura, Xin Fu Tan, Kazuhiro Nogita, The University of Queensland.

Richard Coyle, Ph.D., Nokia Bell Labs, for the paper “Thermal Fatigue of QFN and Chip Resistor Solder Joints Assembled with SnPb, SAC305, and SnBi Solders." Co-authors include Faramarz Hadian, Eric Cotts, Binghamton University; Xinzhi Feng, Martin Anselm, Ph.D., Rochester Institute of Technology; Richard Popowich, Nokia; Lenora Clark, ESI Automotive.

Tim Pearson, Collins Aerospace, for the paper “Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-Free Solder Alloys." The work was a joint effort by a large group of co-authors as part of the iNEMI Alternative Alloys Program and the High Density Package (HDP) User Group.

The following five papers received honorable mention:

Aileen Allen, HP Inc., for the paper “A Review of the Impact of Dopants in Sn-Bi Solder Alloys." Co-authors include Helen Holder, Elizabeth Benedetto, HP Inc.

Jean-Paul Clech, EPSI Inc., for the paper “Predicting the Saturation of Solder Joint Cycles to Failure with Thermal Cycling Dwell Times."

Richard Coyle, Ph.D., Nokia Bell Labs, for the paper “Improved Thermal Fatigue Reliability of SAC305 due to Mixed Metallurgy Assembly with a High-Performance Bi-Bearing Solder Paste." The work was a joint effort by a large group of co-authors as part of an iNEMI Project.

Tae-Kyu Lee, Ph.D., Cisco Systems, for the paper “Low Melting Temperature Solder Interconnect Thermal Cycling Performance Enhancement using Elemental Tuning." Co-authors include Kendra Young, Portland State University; Nilesh Badwe, Raiyo Aspandiar, Satyajit Walwadkar, Intel Corporation; Young-Woo Lee, Hui-Joong Kim, Junk-Tak Moon, MK Electron Co., Ltd.

Kevin Byrd, Intel Corporation, for the paper “Functional System Observations of Tin-Bismuth Low Temperature Solder Electromigration Behavior." Co-authors include Brian Franco, Intel Corporation.

The authors will receive their awards during a ceremony at SMTA International 2023. The SMTA International Conference and Exhibition (SMTAI) 2023 will be held October 9-12, 2023 at the Minneapolis Convention Center in Minneapolis, MN, USA. Details on participating in the 2023 SMTA International Conference are posted on the event website: https://smta.org/mpage/smtai-cfa

Abstracts of all papers can be browsed directly in the online Knowledge Base. Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.

DEERFIELD BEACH, FL – Inovaxe, a world leader and provider of innovative material handling and inventory control systems, today announced the appointment of Juan Arango to Senior VP of Sales & Marketing for the Americas, reporting to Ben Khoshnood, President and founder of Inovaxe Corporation based in South Florida, USA.

A high-energy and enthusiastic sales executive, Arango has more than 30 years of experience in the electronics assembly industry. Using his deep-rooted experience from industry-leading companies like Universal Instruments, Panasonic Factory Solutions and Koh Young America, Arango has enjoyed a career demonstrating consistent success for business and market share growth, with expansions in the US, Latin America, Europe and Canada.

Ben Khoshnood added, “Juan brings a wealth of experience from the SMT manufacturing industry to our company. With his extensive knowledge and impressive track record of success, Juan will play an integral role in driving Inovaxe forward and further strengthening our position as a leading provider of innovative smart material handling solutions. We are thrilled to have him on board and are confident that his contributions will help us continue to expand in the dynamic and ever-evolving world of electronic manufacturing.”

A Bachelor of Science in Electrical Engineering from the University of Texas at Dallas and a Master of Business Administration from the University of South Florida support Arango’s practical manufacturing knowledge. Consequently, his combination of skills has helped advanced a market- leading position for companies within the electronics manufacturing industry in the Americas. Arango is always ready to adjust strategies, implement policies, and realign to ensure immediate and sustained growth.

Inovaxe’s storage solutions streamline SMT material handling processes by decreasing handling time, cutting out errors and manual data entry, stopping line-down occurrences, reducing storage space and eliminating the black hole of WIP.

For more information about how Inovaxe’s innovative material handling systems and services can improve your inventory accuracy and reduce your labor costs, visit www.inovaxe.com

CAMBRIDGE, UK – Integrating multiple functionalities within a single entity promises simpler, more efficient devices without compromising capability. Smartphones are a great example, with maps, diaries, phones, cameras, games consoles, and more integrated into a single, compact device. However, the smartphone itself is arguably a masterpiece of packaging, containing many different components from different suppliers that are mounted onto a chassis.

What if, rather than assembling numerous subsidiary components and ensuring electrical connectivity, the functionality was integrated into the object itself? This is the promise of ‘3D electronics’, where the boundaries between mechanical and electrical design fade away and components have the electronic functionality embedded within them. This approach can be applied to many length scales, with electronic functionality in the form of conductive inks and components are applied onto the surface of 3D objects, termed ‘partially additive’, or incorporated internally (termed ‘fully additive’, akin to 3D printing with electronics included).

In-mold electronics (IME) is a third approach to producing embedded electronics, generally in the form of smart surfaces with integrated lighting and capacitive touch sensors. With IME, conductive inks are printed and components are optionally mounted onto a flat surface that is subsequently thermoformed and enclosed via injection molding.

Benefits and Challenges

Embedding electronic functionality within an enclosed part via fully additive electronics or IME offers a compelling value proposition: fewer parts, fewer connections, simpler supply chains, minimal assembly, lower weight, and improved sustainability. The ability to access these benefits with established manufacturing methods such as screen printing, thermoforming and injection molding means that IME has received extensive interest from OEMs across multiple sectors and from materials suppliers. But is there a downside to embedding electronic functionality? After all, functional foil bonding, a competing approach to IME with less integration that also enables backlit touch-sensitive interfaces, has gained considerable commercial traction and is deployed in multiple vehicles today.

Arguably the main challenge for embedded electronics methods such as IME is that the product of individual yields determines the overall production yield. As such, the yield of each constituent process, including those that are purely decorative, must be extremely high – if there is a problem with any process step, the entire part must be discarded. IDTechEx has been told that the biggest yield concerns for functional surfaces are associated with producing a glossy black decorative exterior rather than the electronics themselves.

The second challenge associated with integrating electronic functionality is reconfiguring supply chains. If the separate components are assembled, then each part and hence supplier can be changed independently. In contrast, if all the components are integrated within a single part via IME or fully additive electronics, then mutual compatibility must be ensured, reducing the ease of switching suppliers and potentially increasing component prices.

When Is Functionality Integration Worthwhile?

Determining when the functionality integration offered by IME is most compelling requires consideration of two parameters: degree of integration and production volume. Achieving the requisite high yields and reconfiguring the supply chain imposes high initial costs but can reduce variable costs since less material is used and less assembly is required. Furthermore, greater integration, such as embedding integrated circuits (ICs) within IME parts to provide processing capability, further reduces material and assembly costs.

As such, IDTechEx suggests that embedded electronics, either IME or fully additive, will have a higher value proposition as both production volume and the extent of functionality integration increase.

Additional Information

IDTechEx’s reports “3D Electronics/Additive Electronics 2022-2032” and “In-mold Electronics 2023-2033” provide comprehensive insight into these emerging manufacturing methodologies. Drawing on interviews with companies and conference visits, both reports evaluate the competing technical processes, material requirements and applications. Each report includes 10-year market forecasts segmented by technology and application sector, expressed as both revenue and area/volume.