HANOVER, GERMANY – At SMTconnect in Nuremberg, Germany, Viscom AG will showcase the successor of the almost legendary S3088 ultra gold, the iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements in industrial use. The latest AI-supported software applications and technical advancements in X-ray inspection will also be presented to visitors "hands-on" at the booth.

Viscom's product portfolio is growing and offers a very wide variety of powerful systems for different production stages and inspection requirements – especially for quality control in modern electronics manufacturing. Automatically monitored operational stability, location- independent networked condition monitoring, cloud-based solutions, the integration of manufacturer-independent interfaces and targeted use of artificial intelligence are just as much a part of this as ensuring audit-proof repeat accuracies or ever higher resolutions while maintaining low cycle times. At booth A4, 120, Viscom will provide detailed information on the latest trends in various areas of its in-house inspection technologies from May 9 to 11, 2023.

If, for example, electronic components need to be inspected for presence as quickly as possible or the heights on an assembly need to be measured precisely, the existing 3D methods of automatic optical inspection (3D AOI) are the recognized industry standard. Complementing the above two features, reliable 3D solder joint inspection also plays a significant role – all distinguished by impressive reliability with systems such as the new iS6059 PCB Inspection Plus from Viscom. Featuring nine views in first-class resolution and with 26% more pixels, variable illumination, larger angular field of view sizes at the same resolution, further increases in data transfer rates combined with 25% faster image capture and extensive networking options – it provides a solid basis for unbeatable line-integrated performance. The iS6059 PCB Inspection Plus offers advanced inspection methods for fully automated verification of whether the solder joint of even the smallest electronic component is normal or too thin – no matter if cycle times are short. Another 3D AOI system at the Viscom booth is the S3088 ultra chrome, which is successfully used worldwide today – giving it a role akin to company "work horse". It will be presented in combination with state-of-the-art handling and smart verification – which now additionally offers new forms of assistance with artificial intelligence.

AI is currently a major topic at Viscom. It is also used when it comes to measuring voids in solder joints as part of an X-ray inspection and excluding defects due to individual factors. Viscom systems such as the iX7059 PCB Inspection XL shown at SMTconnect detect these and other hidden defect types. Viscom offers high-performance 3D inline X-ray for a very wide range of products – be they flat assemblies up to 1600 mm long or compact, solid objects weighing up to 40 kg. Thanks to its tremendous international success, the X7056-II combined 3D AXI / 3D AOI will also be showcased. Special features of manual and semi-automatic X-raying will be demonstrated on the X8011-III 3D MXI system. Inspection solutions specifically for power electronics requirements will be presented by Viscom at booth 6-114 at the neighboring PCIM Europe, which is taking place in parallel.

CLINTON, NY – Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.

The arrival of lead-free soldering in SMT assembly forced peak reflow temperatures to increase by as much as 40°C over those of tin-lead soldering. This requirement was driven by SAC305, the most common lead-free solder, having a melting temperature of about 220°C, 37°C above tin-lead’s 183°C. These higher reflow temperatures can stress the components and printed wiring board (PWB) as both are composed of polymer materials.

Dr. Lasky’s presentation will review the tin-bismuth research and summarize its conclusions. He will also include an overview of a new alloy technology which employs two constituents with different melting points to create a unique solder with outstanding mechanical properties.

“Considerable effort has been made to develop lead-free solders with lower melting temperatures; however, the resulting tin-bismuth solders have generally performed poorly in drop shock testing despite their success in thermal cycle testing,” said Dr. Lasky. “I want to thank the SMTA for entrusting me with the forum to share my insights and help drive our industry forward.”

Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. He has authored six books and contributed to nine others on science, electronics, and optoelectronics; he has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics such as electronics packaging, materials science, physics, mechanical engineering, and science and religion.

Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 for his “significant and continuing technical contributions to the SMTA.” He was also awarded SMTA’s prestigious Founder’s Award in 2003.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their cooperation with Engelet Eletrônica to bolster the company’s technical support in Brazil.

AIM continues to aggressively invest in strengthening its support network in South America. Anderson Albuquerque, AIM’s Technical Sales Manager has been successfully supporting the electronics industry in Brazil for nearly eight years. The addition of a stocking facility in 2020 enabled the company to deliver on its promise of offering innovative soldering solutions directly to the growing Brazilian market. Now, founder and CEO of Engelet Eletrônica, Demétrius Nunes Maciel, brings over 14 years of international experience in the manufacturing and electronics industry to AIM’s expanding customer base in this important region.

“We are pleased to have enlisted the services of Engelet Eletrônica, specifically Demétrius, to support our growing sales and support team in Latin America,” said AIM’s National Sales Manager of Mexico and Latin America, Oscar Lopez. “We are confident that his expertise will further strengthen AIM’s position as a leading technical resource throughout the electronics industry in Brazil.”

Based in southeastern Brazil, Demétrius can be reached at dmaciel@aimsolder.com 

HOUSTON, TX – DarkPulse, Inc. ("DarkPulse" or the "Company") a technology company focused on the manufacture, sale, installation and monitoring of laser sensing systems based on its patented BOTDA dark-pulse sensor technology (the "DarkPulse Technology") which provides a data stream of critical metrics for assessing the health and security of infrastructure for applications in border security, pipelines, oil and gas, aviation and aerospace, mine safety, and renewable energy today announced the State of Arizona has approved the application for a trade name of the Company's wholly owned subsidiary TJM Electronics West, Inc., a contract electronics manufacturer based in Tempe, Arizona for "DarkPulse Electronics Manufacturing" ("DEM"). DEM is ITAR registered and holds ISO9001 and AS9100 certified electronics and electro-mechanical assembly certificates and an assembly team trained to IPC 610 and J-STD-001 standards, Class 2 and 3.

Dennis O'Leary, Founder & Chief Executive Officer of DarkPulse stated, "We recognize the value in brand management and believe operating under one company name is beneficial for the growth and expansion of our manufacturing business. DarkPulse Electronics Manufacturing can build and fabricate quantities from as little as two units allowing for cost effective prototyping while offering full manufacturing capabilities as your project progresses."