TUCKER, GA ― TAGARNO, a leading provider of digital microscopes, has developed a new ‘how to’ guide for implementing digital microscopes for soldering and PCB inspection. Magnification has been an integrated and crucial part of PCB production and rework for many years, and digital microscopes have taken PCB inspection to the next level.

What many electronics professionals find today is that traditional magnification systems can no longer provide the required magnification levels when doing quality control or when reworking faulty PCBs – nor are they equipped to capture photos and create documentation of your work in an efficient way. This sends PCB manufacturers hunting for new equipment that can do the job.

In this guide to digital microscopes within electronics, TAGARNO provides a detailed overview on:

• What to consider when choosing a digital microscope for soldering and PCB inspection
• The benefits of using a digital microscope for soldering and PCB inspection
• Different Electronics processes where you can use a digital microscope
• Choosing the best digital microscope for soldering and PCB inspection

TAGARNO’s line of microscopes offers a range of features and capabilities that make them ideal for a variety of applications. The company’s digital microscopes are designed to make it easier than ever to capture and share. For more information, visit www.targarno.com 

LYON, FRANCE – Fan-Out packaging revenue was US$1.86 billion in 2022. Yole Intelligence, part of Yole Group, expects it to have a CAGR of 12.5% through 2028, reaching US$3.8 billion. UHD FO will experience the fastest growth across all market classes, with a CAGR of 30%, growing from US$338 million in 2022 to US$1,630 million in 2028.

According to Gabriela Pereira, Technology and Market Analyst at Yole Intelligence: “HD FO is the dominating market class in 2022 with US$1,194 million in revenue, and it will have a 6.7% CAGR, reaching US$1,757 million in 2028. Core FO will have a 2.8% CAGR, increasing from US$329 million in 2022 to US$389 million in 2028. FO WLP volume will still dominate the market, with wafer production of 2,376K in 2028, versus 238K 300 mm wafer equivalent production for FO PLP . Total FO package volume will grow from 2,348 million units in 2022 to 2,960 in 2028. TSMC is the biggest FO packaging player, with 76.7% of the market”.

Indeed, as Yole Intelligence’s analysts affirm, the top three OSAT companies, ASE, Amkor, and JCET, together with TSMC, had more than 90% of the fan-out market in 2022.

In this context, Yole Intelligence releases its semiconductor packaging report, Fan-Out Packaging 2023. In this report, the company – part of Yole Group – identifies and describes which technologies can be classified as FO packaging and defines market classes. It also analyzes key market drivers, benefits, and challenges of FO packages for the different applications, the different existing technologies, their trends, and roadmaps and analyzes the supply chain and fan-out packaging market landscape. In addition, this report provides a market forecast for the coming years and estimates future trends.

FO packaging has evolved from a low-end packaging technology into a high-performance integration platform, with growing adoption in the HPC , networking, automotive, and high-end mobile markets. One of the major market trends driving fan-out packaging technology is large die partitioning into chiplets and heterogeneous integration. Fan-out is a cost-effective platform that enables high-bandwidth and high-density die-to-die interconnections through RDL -based processes. UHD FO will take market share from Si Interposers in the future through innovative FO-on-substrate and FO-embedded bridge solutions.

TSMC is the market leader in high-performance FO solutions for high-end computing, networking, and HPC applications. ASE, SPIL, Samsung, JCET, Amkor, PTI, TFME, and Nepes are developing similar solutions with huge potential to compete. Though core FO is the primary OSAT market, the main developments are in HD and UHD FO technologies.

FOPLP has been hyped as the solution for the widespread adoption of FO, especially for large package sizes. However, it still presents technical challenges, and there is a lack of demand to achieve the desired cost benefit.

Yole Intelligence’s semiconductor packaging team invites you to follow the technologies, related devices, applications, and markets on www.yolegroup.com.

SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the appointment of Adam Szychowski to Vice President, Sales & Marketing. An award-winning sales and marketing leader, Szychowski has more than 20 years of experience in starting up, turning around, and growing commercial sales teams in both private and public sectors.

In previous roles, Szychowski has rebuilt inside and outside sales teams by recruiting former employees in key management roles and changing policies and procedures to be more customer centric. He is a motivational and inspirational leader that develops high performance teams by empowering team members with clear expectations, sufficient tools, strategic game plans and a closed-loop feedback system.

Szychowski is hyper focused on creating a world- class customer experience and uses voice of the customer to change and adapt to new industry demands and customer requirements. Additionally, his extensive background in military and aerospace in the EMS space is a great fit as these are key target industries for Green Circuits.

As a leader in the industry, Green Circuits has more than 30 years of experience culminating in an extensive knowledge of printed circuit board fabrication and assembly. The company is built on a commitment to quality and a focus on speed and service. Green Circuits specializes in quick-turn prototypes, new product development, and early-stage production to speed customer product launch.

Green Circuits provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. For more information, visit www.greencircuits.com 

CLINTON, NY – As one of the industry’s foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico, April 18-20. Among its featured Au-based products, Indium Corporation will showcase its AuLTRA™ ThInFORMS™—0.00035” thick (0.00889mm or 8.89μm) 80Au/20Sn preforms.

As a leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280°C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:

• Highest tensile strength of any solder
• High melting point compatible with subsequent reflow processes
• Superior thermal conductivity
• Resistance to corrosion

An excellent choice for die-attach applications, AuLTRA™ ThInFORMS™ improve the overall operational efficiency of high-output lasers. They help combat issues such as:

• Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
• Poor thermal transfer—the ultra-thin 0.00035” preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device

To learn more about Indium Corporation’s Au-based solutions, visit https://www.indium.com/products/solders/gold/ or stop by our booth at HiTEC.