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Press Releases

GARDENA, CA ― Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce that the company has added direct support in Canada. In addition to its local manufacturers’ representative, BROCK Electronics, the company has hired a specialized printed circuit board assembly (PCBA) technician with extensive hands-on experience based in Toronto, Canada.

Pemtron’s new Field Service Engineer has proven experience with SMT & PTH machine programming, setup and operation, preventive maintenance, troubleshooting and problem solving. In addition to providing maintenance and support, the new FSE will help Pemtron customers improve production efficiency and production quality. He earned his degree in Electronics Engineering.

Pemtron aims to become the unrivaled global No. 1 company in the field of inspection equipment based on state-of-the-art equipment equipped with the best hardware and software. Offering local support for its customers worldwide is a key step in the company’s strategy.

“Due to travel restrictions at the beginning of COVID-19, it was difficult to get to our customers in Canada,” said Steven T. Wongsonvanee, General Manager - Americas. “This is why it is so important to have feet on the ground and the ability to offer our customers in Canada fast support.”

Pemtron manufactures and sells 3D precision process inspection equipment in the SMT, semiconductor and secondary battery fields. Its equipment is based on inspection technology using 3D measurement and AI deep learning based on machine vision and image processing S/W technology using industrial high-speed camera images.

BROCK Electronics represents Pemtron throughout Canada. Founded in 1967, BROCK Electronics is a manufacturers’ representative providing equipment and supplies to the electronics assembly industry in Canada. For more information, visit www.brockelectronics.com.

CLACKMAS, OR – MaRCTech2, Inc., a Manufacturers’ Representative organization providing products and services to technology companies in the Pacific Northwest, is pleased to welcome Dylen Brewer to their sales team. Brewer is based out of the Clackamas, Oregon, office and servicing accounts in Oregon, S.W. Washington and Idaho.

Brewer’s previous experience as a business owner and several service-related jobs has positioned him to have an immediate impact when it comes to “serving the customers first.”

“Dylen will be able to provide the sales and service our expanding customer base and product lines demands,” says Jennifer Eby, Co- Founder of MaRCTech2.

Mike Gunderson adds, “Dylen’s ‘Customer First’ approach and ‘do what it takes’ work ethic will prove valuable to our customers, principals and company.”

STRAMBINO, ITALY — Customers looking for leading-edge test solutions can come to Seica’s booth 2511 and view the newest line of Flying Probe test on the market in the form of the PILOT VX platform, bed of nails ICT solutions, the Compact LR, and Mini200 and the latest conformal coat inspection systems, the Dragonfly.

Visitors to Apex 2023 will see the premiere of the Compact LR, the latest addition to Seica’s already well-known in-circuit bed of nails and functional test solutions included in the COMPACT Next line. Seica’s COMPACT line of test systems are already the solution of choice for many contract manufacturers and OEMs, and the Compact LR provides additional legacy replacement capabilities for customers looking to replace test systems which are no longer supported by the original manufacturers.

This new configuration joins Seica’s existing legacy replacement solutions for in-circuit testers such as Aeroflex/Marconi as well as for functional testers including Computer Automation, Schlumberger/Factron, GR179X, and GR275X series, and Teradyne’s L2XX, and L3XX. The Compact LR on display addresses the challenge of allowing redeployment of Teradyne Spectrum 8851 and 8852 fixtures onto a modern platform which includes all of the technologically advanced performances required by new applications, while at the same time allowing developers to continue to use their traditional standard fixture design.

We are looking forward to seeing you at Booth 2511!

WATERBURY, CT — MacDermid Alpha, a leading global supplier of integrated circuit, assembly and semiconductor solutions for the electronics design and manufacturing industries, will be highlighting their latest research on final finishes, lightweight bio-based polymers, solder alloy reliability for automotive applications, and brand new findings from test data on conformal coatings. The four separate technical presentations will take place at this year’s IPC APEX EXPO, January 24 – 26, at the San Diego Convention Center in California.

Authored by MacDermid Alpha’s leading industry experts, these papers will address various material challenges, testing methods, and new solutions that will help manufacturers of Automotive, 5G, Mobile, and other critical markets, to meet the increasing demands of reliability, performance, cost efficiency, and sustainability.

Two papers are scheduled under the High Reliability for Extreme Environments Track. Bethany Turner, Senior Technical Manager and Resins Specialist, will present the paper entitled “Expandable Bio-Based Polymers: A Lightweight Future for Electronics Ruggedization - Immersion Study”. Bethany’s presentation will take place on January 24, 10.30am-12pm, and will explore an important new manufacturing trend, known as “Lightweighting”.  Lightweight materials are not only ideal for portable devices, but are also valuable for other applications, such as mass transit and automotive systems.  Kennedy Fox, Reliability Failure Analysis Scientist, will present “Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications” on January 24, 1:30- 3pm. The paper analyses the performance of solder pastes and more specifically, how a paste’s resilience to vibration fatigue can influence the failure of an entire electronic unit in a vehicle.

As part of the PCB Plating and Finishes Track, Frank Xu, Technology Manager Final Finishes, will present “Reassessing Surface Finish Performance for Next Generation Technology” on January 22, 8-11am. Finishes such as aImAg, ImSn, OSP, ENIG and ENEPIG are well established in the decision making process for PCB fabricators when considering cost and performance. 5G is growing in importance and requires increased data flow. One challenge is signal loss, especially at higher frequency bandwidth.. Fabricators are once again looking to the next generation surface finishes to resolve the issue of signal loss; this paper compares and contrasts performance attributes of a range of finishes.

Phil Kinner, Global Business and Technical Director for Coatings, will present “A New Approach To Conformal Coating Demonstrates Significantly Improved Ruggedization Performance” in the Cleaning and Coatings Track. Phil will explore test data using the IPC- TR-587 technical report, ‘”Conformal Coating Material and Application ‘State of the Industry’’’ as the basis to compare the performance of assemblies coated with state-of-the- art materials as opposed to standard coatings used by manufacturers. In his presentation, which takes place on January 25, 3:30-5pm, Phil will examine the new findings from tests that show how a natural, slight shift in position of components during soldering could yield very different coating patterns and coating coverage, resulting in inconsistent protection from one board to the next.

The MacDermid Alpha team will also be welcoming visitors to Booth 1933 to discuss more about these subjects and our latest solutions that can deliver greater reliability and performance for today’s increasingly complex electronics assemblies.

For further information, please visit www.macdermidalpha.com

MANASSAS, VA — ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that they will exhibit at the 2023 IPC APEX Expo and offering live demos of the all-new ZESTRON EYE CM II.

Incorporating the ZESTRON® EYE CM II into your process provides an efficient and fully automated solution that monitors, and controls wash bath concentration in real time. This stand-alone concentration management system easily integrates with all cleaning systems providing reliability and control you can trust.

ZESTRON will be offering live demos of the all-new ZESTRON EYE CM II at Booth #1941. The ZESTRON EYE CM II, made in the USA, has multiple advantages such as wash bath concentration monitoring and control, a graphic interface that tracks and records cleaning agent and Di-water usage, the ability to track cleaner pump runtime with bath change alerts, easy downloading capabilities via Ethernet or USB.

To schedule a demo or to speak with one of ZESTRON’s engineers about your cleaning needs, please visit: ZESTRON APEX 2023

CLINTON, NY — Indium Corporation® will feature its compressible metal thermal interface materials (TIMs) and award-winning flux-cored wire at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.

Indium Corporation’s wide portfolio of proven products provides solutions to the emerging industry challenges of today and tomorrow.

Indium Corporation’s Heat-Spring®, a soft metal alloy (SMA) thermal interface material (TIM), reduces thermal resistance and enhances cooling by utilizing two key properties of indium metal—superior thermal conductivity and malleability. As added benefits, indium metal will not dissolve in immersion fluids and is considered an environmentally-friendly TIM because it can be re-used, reclaimed, and re-formed.

Indium Corporation’s patented SMA-TIMs made of indium and other alloys offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow (conductance). SMA-TIMs can easily be placed by hand or with tape & reel and automation.

Unlike standard thermal interface materials, Heat-Spring® offers an extremely long service life as it does not pump-out under power cycling, nor does it bake-out over time. This combination of high conductance, a multi-patterned surface area to optimize contact with non-planar surfaces, and low degradation over time produces a superior thermal interface and assures optimized long-term device performance in compressed interfaces. Pattern options depend on applications such as immersion cooling, TIM1 to bare die, TIM2 for lidded CPU, or GPU applications. Indium Corporation also offers special cladded diffusion barrier TIMs just for burn-in and class testing.

Indium Corporation’s CW-818 flux-cored wire is designed to meet the demanding requirements of today’s manual and robotic soldering processes. CW-818 provides fast wetting speeds, allowing users to minimize cycle times. The spatter control technology minimizes flux spattering while the heat-resistant nature of the formula reduces flux build-up on the soldering iron tip as well as leaves a clear, non-tacky residue post-soldering (even when using a high iron tip temperature). The combination of superior soldering performance, improved overall cleanliness, and excellent visual appearance post-soldering delivers a truly no-clean flux-cored wire.

Indium Corporation’s extensive manufacturing process control ensures that CW-818 cored wire provides precisely the right amount of solder while minimizing process setup challenges and maximizing yields. CW-818 is void-free, and with consistent diameter and layer winding, prevents stoppages due to lack of flux or kinks when drawn into a robotic soldering machine. The result is an extremely reliable and strong solder joint.

To learn more about Indium Corporation’s metal thermal interface materials, visit http://www.indium.com/TIMs. Information on its award-winning flux-cored wires can be found at https://www.indium.com/products/solders/solder-wire/flux-cored-wire/.

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