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WANCHAI, HONG KONG – A Chairpersons View, listening to customers, shaping the direction, upholding Ryder's vision, mission and values.

When I reflect on 2020 into 2022 and throughout, I need to state that COVID-19 and variations of, were gentle with Ryder. To put that into context, the team carried out a magnificent job to mitigate risk.

We applied strict controls of “Zero COVID” and fortunately experienced no casualties. During this time, we focussed on maintaining our own personal health and wellbeing as well as that of our company. We reflected on what lessons we learned. We developed, and as a positive result, sales grew.

In stark contrast to others in the Electronics Manufacturing Industry (EMS), our supply chain continued to flow well, albeit demanding a lot of hard and smart work from both our intelligent in-house supply team experts, as well as our established and reliable network of Original Component Manufacturers (OCMs). To test our resilience, we experienced only one state-ordered lockdown, but being proactive, this didn’t stop our team from manufacturing. We proficiently and rapidly opened our own on-campus accommodation and kept on making with our supply chain moving.

Like everyone else across the globe during COVID-19, we had a reliance on a new way of doing business, via online communication portals, and again, I must sing the praises of our team who adapted quickly to this new world. Training and development took place as we learned how to showcase to our OEM customers our ability to remotely design, engineer, develop, manufacture, and deliver from product introduction, to realisation, to fulfilment. This demonstratable evidence has led to new and existing opportunities, repeat business, and new contracts being awarded to Ryder. A true testament to how flexibility, and a can-do attitude helps in challenging times.

Taking this time to think strategically with our minds positioned for growth, we moved a large part of our manufacturing capability to our Inland facility. As planned, this freed up significant space within our Coastal plant, which is in the world-class engineering city of Shenzhen, for our exciting new Advanced Manufacturing Hub. Here, we will focus on materials, components, processes, and skills and we’re pleased to say that we’ve already seen positive signs with one of our OEM customers. We’ve gained significant market share thanks to our custom development team engineering a unique and tailored solution based on their individual market needs.

As I discuss our different facility locations, I am acutely aware that the term “Geopolitical risk” has risen in prominence these days and is gaining increased international attention. The “Geo” part is not a challenge for Ryder, as our plants are in a seismic quiet zone, they are 450km (300 miles) apart, and they access multiple seaports. We are also incredibly proud to be embedded in China’s extensive and robust industrial supply base. The “political” dimension is being addressed by a dual effort, for electronics, Ryder runs a four-year-old partnership within Thailand, which satisfies the United States import controls, and a plastics solution is being prepared. During 2023 we will be able to comment on this further and share our solution with you.

We can’t say for certain whether COVID-19 has made companies more environmentally aware, but regardless, we are pleased that ESG (Environmental, Social and Governance) is getting more attention worldwide, and that companies are being assessed on these principles.

At Ryder Industries, we have been putting Environmental principles into practice since we opened our inland plant in 2012, with six new systems for energy and water conservation. With those years of experience, we extended these in our 2021 expansion, and they have worked very well for us.

And it’s not all about the ‘environmental’ part of this program, at Ryder we have been pushing ahead with our Social dimension too, running a dual-option six-month paid maternity leave policy. The “glass ceiling” received attention, too. Not simply with quotas, but with consultation, development training, and dynamism, resulting in near perfect female numerical parity of managers.

I’d like to conclude with a message to our team to ensure that they fully understand how much they are valued, not only through the challenging times, but we do applaud their extraordinary performance during these testing times. The exciting years ahead bring new projects and new opportunities for us all.

By Eric Winkler, Chairman

REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices announces Noa Leading Co., Ltd will offer SentriX® security provisioning services in Japan. Noa Leading Co. is Data I/O’s exclusive sales distribution partner in Japan and is an established supplier of programming services to the Japan market. Security provisioning will be available to customers effective immediately.

“Mass-market adoption of IoT devices is driving demand for OEMs (Original Equipment Manufacturers) to design and manufacture secure products. Data I/O is excited to work with Noa Leading to establish the first SentriX security provisioning service in Japan,” states Anthony Ambrose, president, and CEO of Data I/O Corporation. “Noa Leading is well respected in the Japanese market with strong established relationships with semiconductor partners and has demonstrated a strong capability for high-quality product, service, and technical support. Noa Leading is well positioned to represent Data I/O in Japan’s electronics market.”

“Over the past 8 years Noa Leading Co., Ltd. has successfully programmed millions of devices through our programming service utilizing PSV7000 systems from Data I/O,” states Shosei Tamayama, president and CEO of Noa Leading Co., Ltd.  “Noa Leading is excited to expand our data programming service to offer security provisioning to our Japanese customers. By upgrading our PSV7000 to add Data I/O’s SentriX security provisioning capability, implementing physical security at our facility, and achieving ISO 27001 certification Noa can deliver simplified IoT security and data programming solutions to OEMs of any size cost-effectively.”

The SentriX security deployment platform enables Noa Leading and OEMs to easily define security profiles and provision microcontrollers and authentication ICs “integrated circuits” at the chip level before shipping the device to the manufacturing line for board assembly. Because the SentriX platform supports many security use cases and is scalable, this capability is available to OEMs with low volume but is also cost-effective for high-volume production.

About SentriX Security Deployment Platform

SentriX secures the global electronics supply chain and protects IoT device intellectual property from point of inception to deployment in the field. Data I/O’s SentriX security deployment platform provisions security objects and secrets into semiconductor devices for low volume prototyping applications and high-volume production. SentriX integrates a FIPS 140-2 Level 3 compliant HSM (Hardware Security Module) into an automated programming system which enables secure provisioning of credentials into security ICs and microcontrollers in high-volume. Data I/O’s PSV7000 and PSV5000 can be upgraded in the field to support security provisioning.

SentriX Product Creator is the software tool suite used by OEMs, silicon vendors and programming facilities to define and collaborate on security features provisioned on SentriX. The SentriX Product Creator tool offers OEMs two flexible security deployment models: fully customizable and SentriX GO™ pre-configured security profiles saving time, effort and avoiding potential pitfalls during security deployment definition. The profile definitions completed using the SentriX Product Creator tool are secure at rest and transferred for device provisioning on the SentriX security deployment platform at a secure programming location. OEMs of any size can now securely provision devices from early samples all the way to high-volume production prior to shipping chips to a manufacturing line using a cost-effective as-a-service model. The SentriX Product Creator is available today.

Learn more about SentriX at www.dataio.com/SentriX 

CLINTON, NY – Indium Corporation® will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S.

As an industry leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions.

Indium Corporation’s indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin, among others. The pure indium TIM can be clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface. Indium Corporation’s suite of Heat-Spring® solutions, featuring a compressible interface between a heat source and a heat-sink, include:

Heat-Spring® Preforms

  • Patterned to optimize contact with non-planar surfaces delivering 86W/mK
  • Provides uniform contact between the burn-in head and the DUT
  • Provides more uniform thermal conductivity
  • Cleans with no residue
  • Recyclable and reclaimable

Heat-Spring® HSK

  • Recommended specifically for burn-in applications where multiple insertions are required
  • Provides uniform contact with low resistance for high-density heat loads
  • Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
  • No staining or cracking

Heat-Spring® HSD

  • Designed for interfaces with tight surface control >30psi
  • Recommended for small, well-designed interfaces with flat, smooth, parallel surfaces

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit us at booth #45 at TestConX or online at www.indium.com/TIMs.

DAYTON, OH – Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, is expanding its footprint and capabilities in its manufacturing facility in Guaymas, Sonora State, Mexico. The capability enhancement includes new state-of-the-art equipment supporting sheet metal fabrication and powder coating.

Vertical capabilities at the Guaymas plant include sheet metal fabrication, (targeted at low volume/high mix high reliability applications), in-house batch and continuous conveyor powder coat, CNC milling and turning, grinding, and cables. These vertical capabilities support high level mechanical assembly and systems integration. The expansion is supported by the construction of 84,000 ft2 of new building construction. Libra’s Guaymas operations supports customers’ products in the medical, aerospace, industrial and semiconductor Wafer Fabrication Equipment (WFE) markets.

Libra Industries operates four world-class manufacturing facilities, including operations in Dayton, Ohio; Cleveland, Ohio; Dallas, Texas and Guaymas, Mexico. The company serves a diverse and balanced customer base of industries including medical, military/aerospace, semiconductor and industrial. Libra Industries serves high reliability markets which require customized supply chain solutions with technically sophisticated manufacturing and quality requirements.

Libra Industries continues to invest to provide customized manufacturing solutions for its customers’ complex product requirements. Through its broad range of capabilities, Libra offers its customers the most capable manufacturing team in the industry. For more information about Libra Industries, visit www.libraindustries.com.

DEERFIELD BEACH, FL – Inovaxe, a world leader and provider of innovative material handling and inventory control systems, today announced the appointment of FX Beorchia as VP Sales for EMEA regions, reporting to Ben Khoshnood, President and founder of Inovaxe Corporation based in South Florida, USA.

Beorchia was the former European Business Development Manager of Smart Factory software solutions at Panasonic Connect, and previously VP of International Business Development for iTAC Software, a well-known MES provider based in Germany. "The elegance of Inovaxe solutions, both hardware and software, are unparalleled in the market. The maturity of connected material management solutions is further reinforced by the deployment of Inovaxe technologies in the largest electronics manufacturers, automotive, industrial and EMS. All of Inovaxe's customers I have met all around Europe are absolutely delighted by Inovaxe's team, smart racks and material management software, which is the best fuel for business development. It is an honor for me to join this very creative and dynamic team," said Beorchia.

Ben Khoshnood added, "FX has a vast experience of SMT automation with a keen understanding of software and connectivity, being involved with total system solutions with an emphasis on material processes. This brings tremendous value to Inovaxe, our customers and our distribution partners throughout Europe and Africa, therefore we are excited to add FX to the Inovaxe team!"

Beorchia earned his Industrial Computer Science Engineer degree from ENSIIE School, member of Paris-Saclay University and graduated with an MBA from Paris-Dauphine PSL University and UQAM in Montréal. He is based in Paris, France.

Inovaxe’s storage solutions streamline SMT material handling processes by decreasing handling time, cutting out errors and manual data entry, stopping line-down occurrences, reducing storage space and eliminating the black hole of WIP.

For more information about how Inovaxe’s innovative material handling systems and services can improve your inventory accuracy and reduce your labor costs, visit www.inovaxe.com.

ATLANTA – The Global Industry Practices Committee (GIPC) has published an Executive Summary with results of two surveys conducted by its core team of subject matter experts (SME) led by Brad Waisanen, VP, Global Cyber Security at TTI, Inc. ECIA member companies were surveyed with the goal of learning how the industry is responding to this serious threat to businesses.

Participants in the first survey represented the three ECIA constituencies as follows: Manufacturers (41%); Distributors (39%) and Manufacturers Reps (20%). The questions covered where organizations were turning to for guidance; whether they had risk management programs in place and for how long; reporting structure of the cybersecurity teams; perceived risks and metrics; costs of insurance; prevention measures and more.

Participants in the second survey represented the three ECIA constituencies in a similar measure: Manufacturers (39%); Distributors (39%) and Manufacturers’ Reps (23%). The questions in the second survey focused on ransomware readiness.

“The results of these two surveys were very enlightening and provide the GIPC Cybersecurity SME with concrete guidance on where to place our efforts going forward,” explained Don Elario, ECIA’s Vice President of Industry Practices. “There were clear differences in how the three constituencies have responded to these types of threats. Not surprisingly, larger companies have more mature cyber risk management programs than smaller companies and we see this as an opportunity for this work group to provide a baseline of cybersecurity best practices, among other initiatives.”

View the results of the two surveys here: Cybersecurity Executive Summary.

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