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CLINTON, NY — Indium Corporation’s Strategic Advisor Dr. Dongkai Shangguan will deliver a keynote presentation on interconnect reliability at the IEEE Symposium on Reliability for Electronics and Photonics Packaging (IEEE REPP) in a hybrid event on Nov. 9-10, Santa Clara, Calif., US., and online.

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical.

The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions, etc. Cu direct bonding, without solder, presents new considerations in interconnect reliability.

At the same time, as electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from mechanical and thermomechanical to electrical and electrochemical. These considerations will impact reliability engineering for semiconductor devices, from design for reliability to accelerated testing and analysis. Yet another important dimension for interconnect reliability involves sustainability of electronic products, which demands environmentally friendly materials and processes, such as no-clean soldering, lead-free soldering, low-temperature soldering, etc.

Understanding of the failure mechanisms for different interconnect materials is of great importance to interconnect reliability and, ultimately, reliability of semiconductor devices and electronic systems.

Dr. Shangguan is a strategic advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also serves as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others.

Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books and more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 28 U.S. patents and several foreign patents.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

About IEEE REPP

This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.

ONEONTA, N.Y. — Custom Electronics, Inc. (CEI), a premier manufacturer of high-quality products for the military, industrial and commercial markets, announces a value-added distribution partnership with Vasantha Advanced Systems (VAS). A leading electronic manufacturing company, VAS provides innovative and customized solutions to fulfill prototyping requirements around the world. As distributor of VAS products, CEI adds to its capabilities and product offerings, while also growing its presence throughout India as well as expanding its commercial reach.

VAS will provide CEI with efficient and reliable electronic manufacturing services. VAS specializes in microcontroller-based products including coils, wiring harnesses and PCB design. With experience in coil indigenization, the company offers a variety of different types of coils such as solenoid, current transformers, miniature coils, ferrite transformers and drum cores. VAS also has the in-house capability to process different types of wiring harnesses, allowing for the design of jigs and fixtures to test harnesses, as well as the supply of harnesses to various industries with high reliability.

A wider range of consumers can now benefit from CEI's offerings, as the brand's partnership with Vasantha is an entry to the India market and additional commercial markets, expanding the capabilities of existing business and broadening both companies reach. By supplying VAS products in the U.S., new and existing CEI customers will also benefit from more advanced PCB assembly, cost reduction and systems design upgrades. Vasantha customers can also benefit from having access to CEI's specialized mica paper capacitors and tailored high-voltage assemblies.

Discussions leading to the partnership between CEI and Vasantha were additionally facilitated through the U.S. Commercial Service's (USCS) 2021 New York State Virtual Trade Mission (VTM) to India, in which CEI was a participant. While CEI and VAS had connected prior to the VTM, participation in the program provided CEI with extensive market intelligence and counseling from an experienced team of U.S government industry specialists across India, coordinated by USCS Senior International Trade Specialist Michael Grossman.

Vasantha products and services are available in the U.S. through Celektronix, a one-stop shop of electronic manufacturing solutions founded by CEI. In addition to the partnership with VAS, Celektronix also offers design, development, batch production, final assembly and testing services.

PLYMOUTH, UK — Bentec is pleased to announce that it has appointed C.H.Erbslöh as SurfX Distributor in Poland.

C.H.Erbslöh is a trusted partner to all its customers across Poland. The company cares about building and strengthening relationships based on mutual understanding and achieving success by earning the trust of customers and suppliers, ensuring integrity and transparency.

“SurfX’s award-winning technology in atmospheric plasma is going to be very exciting to our customers in Poland,” commented Tomasz Binkowski, Technical Sales Representative, C.H.Erbslöh. “We look forward to partnering with Bentec to help SurfX expand in Europe.

Surfx Technologies, LLC is the most trusted name in atmospheric plasma. Whether for gluing, soldering, printing or coating, in-line plasma cleaning will increase yield on the factory floor and reduce defects in the field for years to come. Cleaning and activating the material surfaces prior to bonding is key to achieving defect-free manufacturing. Surfx’s automated, in-line plasma systems are designed for this application.

Surfx argon plasma systems clean and activate a wide variety of material surfaces, including glass, ceramics, polymers, semiconductors and metals. Save money and improve quality with turnkey systems configured for your application.

ABOUT BENTEC

Bentec is a sales and support company based in the UK that also provides a unique “associate” network of partner sales agents and distributors spanning Europe, the Americas and Asia. Several equipment manufacturing companies use Bentec to recruit and manage their international sales organizations due to its global network and vast experience in creating and managing them.

MANASSAS, VA – Zestron, the leading global provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that the Zestron Americas team will be offering a virtual tour of the Manassas Technical Center at SMTAI.

Step Into the Future: Looking for new cleaning equipment? Optimizing an existing process? In need of cleaning trials or cleanliness assessments? You’re in luck! SMTA International attendees will have the opportunity to take a virtual tour of the Manassas Virginia Technical Center, including an in-depth look at inline and batch equipment from ITW, AQT, MB Tech, PBT, and Technical Devices.

At the Zestron Technical Center, our experienced Applications Engineers partner with you and your team to provide an efficient way of testing the most popular industry cleaning machines in one place. Stop by Booth #907 at SMTAI to understand how ZESTRON is a true partner in your success. For more information on what Zestron will offer at SMTA International Expo and to schedule your virtual tour here!

SMTA International Expo will be held at the Minneapolis Convention Center from October 31st – November 3rd, 2022. For more information or to register, please visit smta.org.

About Zestron: Zestron is headquartered in Manassas, Virginia, and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For additional information or to tour one of our technical centers, please visit www.zestron.com.

ALZENAU, GERMANY – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase its award-winning inspection solutions at electronica on 15-17 November 2022 in Munich, Germany. We will present our innovative technologies to a global audience at this leading tradeshow in booth A3.358. Additionally, Koh Young is sponsoring the Advanced Packaging Conference, which event organizers are holding in conjunction with electronica. This technical conference is an important forum for discussing the latest developments in packaging technology. We look forward to meeting you at electronica 2022 and sharing our latest innovations with you.

If you are looking for the latest in conformal coating inspection technology, you will want to check out Neptune C+ and the Neptune T at our booth. Our award-winning technology is sure to be one of the company's highlights.

Neptune C+

Most optical systems use UV light to inspect the surface for presence and gauges to measure material thickness in a particular spot, which does not provide the accuracy and repeatability needed. Inspecting transparent materials proved to be a challenge for traditional laser-confocal or electron microscope systems that only measure three-dimensional shapes. Koh Young’s revolutionary Neptune C+ delivers the ultimate solution to these challenges. 

Neptune T

The Neptune T is the world's first 3D optical measurement instrument for transparent materials. It is available for coating, underfill, epoxy, glue, and bonding material inspection. With its patented L.I.F.T. technology, the Neptune T provides accurate thickness measurement of even the most transparent materials.  The system allows manufacturers to explore depths of its process and accurately identify defects with 2D, 3D, and cross-section views.

Koh Young offers a full range of inspection solutions for advanced packaging and mini- and micro-LED applications. You can learn more about these innovative systems and our multiple industry awards by visiting our booth A3.358.  

Meister D

The Meister D is a perfect solution for production-speed 3D inspection of die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chips, foreign material, and more.

Meister S

The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection. 

Additionally, we will present our flagship AOI (Zenith 2) and SPI (aSPIre 3) to show attendees. We offer the opportunity to discover the industry´s best performing True 3D inspection solutions.

Zenith 2

The AOI sets new standards with novel SMT process management tools by combining advanced vision algorithms with innovative high-resolution optics, allowing a wider inspection coverage including advanced tall component inspection. The Zenith 2 delivers clear and concise AOI measurement to accurately identify multiple defects such as missing solder, offset, polarity, upside down, OCV/OCR, solder fillet, billboarding, lifted lead, lifted body, tombstone, bridging, and more. 

aSPIre 3

The SPI delivers the highest standard in the metrology- level True 3D SPI market, ensuring incomparable performance for the most demanding applications. The inspection system uses our AI platform for print process optimization with the award-winning Koh Young Process Optimizer (KPO).

If you cannot attend the tradeshow, you can learn more about Koh Young and its best-in-class inspection solution technologies, including our updated website at www.kohyoung.com.

About Koh Young Technology, Inc.

Established 20 years ago in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and maintains the dominant global market share in the SPI and AOI markets with over 20,000 machine installations. By adopting a user-centric R&D focus, it continues to use its core competencies to develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its global sales and support offices in Europe, Asia, and the Americas. These local offices ensure it stays close to the market, and more importantly, its growing customer base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection for a smart factory at www.kohyoung.com.

For More Information

Koh Young Technology, 14F Halla Sigma Valley, 53 Gasandigital 2-ro, Geumcheon-gu, Seoul, Korea 08588 marketing@kohyoung.com or www.kohyoung.com

FREMONT, CA — VVDN Technologies, a global provider of engineering, and digital services and solutions, today announced it has entered into a multi-year global strategic partnership with Google Cloud. The partnership will help customers accelerate app modernization and cloud transformation. VVDN will also develop the next generation of innovative solutions, namely IoT and Video Cloud Platform, and a NextGen Enterprise Private 5G Cloud, etc., through this new partnership with Google Cloud.

Through this partnership, VVDN’s enterprise customers will gain greater financial flexibility, and the ability to accelerate their cloud migrations and modernize their enterprise applications on Google Cloud. Once on Google Cloud, customers will be able to immediately begin creating hybrid applications that enable businesses to be more agile, with more secure access to Google Cloud services like BigQuery and Cloud Operations, and extend their existing disaster recovery, backup, and storage services.

Furthermore, VVDN and Google Cloud are setting up a joint CoE to work on IOT, Video Cloud, and Enterprise Private 5G Cloud.

In the IoT and Video Cloud space, VVDN is developing a SaaS-based Device Agnostic IoT Cloud solution with Google Cloud for onboarding smart devices, cameras, and more. The solution is based on a scalable and secure architecture that can be delivered for multiple applications and serve a variety of use cases. Building blocks are engineered to accelerate deployment for multiple industries including IoT, Security and Surveillance, Automotive, Networking and Wireless, and more.

As part of a wider 5G strategy, VVDN aims to bring its respective 5G expertise and become an end-to-end Enterprise Private 5G provider with Google Cloud. VVDN 5G Cloud services include: end-to-end service orchestration, VNF optimization, CI/CD and automation, network performance testing, Automation framework development, and application development (i.e Network Management System).

Vivek Bansal, President Engineering, VVDN Technologies: “We are really excited about our newly announced partnership with Google Cloud. This partnership will act as a catalyst for VVDN’s growth and will enable us to scale our customers with the help of Google Cloud’s infrastructure. This joint CoE between VVDN Technologies and Google Cloud will allow us to innovate and build advanced technologies which will be a key driver in our growth. Through this partnership, we aim to develop solutions for IoT, Video, and 5G Cloud Platforms which are in demand.”

“Enterprises around the world are realizing the benefits of adopting cloud technologies in the IOT and private 5G space." said Majed Al Amine, Head of 5G & Edge Telecom Industry Solutions, Google Cloud. "We’re proud to support VVDN's commitment to innovation and are excited to move forward in our journey together."

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