November 9, 2023 - Haverhill, MA USA - Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.

Precision form and trim of SMT flat-pack and axial and radial lead through-hole components are supported in both low and high-volume quantities. A calibrated optical comparator is used to verify that the lead forming meets all specified dimensions.

A robotic hot solder dip (RHSD) component lead tinning process usually follows trim and form to coat the component leads with solder to prevent oxidation or to remove gold plating from the formed leads. Device packaging options include JEDEC trays, tape-and-reel, waffle packs, or custom trays. Components can be MSL-baked and dry-packed per industry protocols.

"For 40 years, leading electronics manufacturing companies have relied on Circuit Technology Center as the world leader and innovator for circuit board damage repair, rework, BGA re-balling, and component modification services," said Andy Price, Sales Manager. "We are thrilled to add this new component trim and form capability to our line-up of service offerings."

For more information about the component trim and form service offered by Circuit Technology Center, visit: https://www.circuitrework.com/services/trim-form.html

AUSTIN, TX -- Flex (NASDAQ: FLEX) announced it received Cisco's 2023 Electronic Manufacturing Services (EMS) Partner of the Year award. Cisco presented the distinguished award at its annual Supplier Appreciation Event (SAE), which celebrates the accomplishments and contributions of its supply chain partners. Flex was recognized for demonstrating exceptional business performance, responsiveness, and collaboration on key supply chain initiatives.

"Being honored with Cisco's prestigious EMS Partner of the Year award recognizes our close collaboration and longstanding partnership of over 25 years to manufacture and deliver technology innovations at scale around the world," said Rob Campbell, President, Communications, Enterprise, Cloud Business at Flex. "As the demand for advanced digital communications solutions continues to grow exponentially for key markets such as enterprise, service provider and cloud, we enable greater agility and resiliency through our advanced manufacturing services, extensive supply chain capabilities, and global fulfillment services. We look forward to our continued partnership with Cisco to further the advancement of their vision to create a truly connected future."

"Our suppliers and partners are essential in delivering the technology and innovation our customers depend on. This annual event is a unique opportunity to show our gratitude and align on our path forward together," said Marco De Martin, SVP of Global Supplier Management at Cisco. "Our theme this year was 'Adapt. Accelerate. Thrive.' which underscored the reality that we operate in an environment of constant change, and yet, our ongoing success depends on a collective understanding that we must treat challenges as opportunities, act with urgency, and seek solutions rooted in partnership. Cisco's supply chain, including its global network of suppliers and partners, will always build world-class products that enable Cisco to securely connect everything to make anything possible."

About Flex

Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps a diverse customer base design and build products that improve the world. Through the collective strength of a global workforce across 30 countries and responsible, sustainable operations, Flex delivers technology innovation, supply chain, and manufacturing solutions to diverse industries and end markets.

Newman Lake, WA (November 7, 2023) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Micropac Industries, Inc. has ordered a Pulsar solderability testing system. The Pulsar system utilizes the highly proven dip-and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder. An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment compared to a wetting balance test system. The Pulsar solderability testing system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208.

About Micropac Industries

Headquartered in Garland, Texas, Micropac Industries, Inc. produces a wide range of optoelectronic components, electronic assemblies. and multi-chip microelectronic modules. Their product range includes power management, DC-DC converters, temperature control, hall effect sensors, and LED displays. For more information, please visit: www.micropac.com.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.

Indium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy®301-LT is a bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.

Available in InFORMS® configurations, Indalloy®301-LT offers a solution for consistent bondline thickness and improved strength to enhance thermal and mechanical reliability of the solder joint while reducing processing temperature and energy input during manufacturing. This enables complementary Pb-free high-reliability alloy technologies such as Indalloy®276 to be used in power module die-attach, component-attach, or interconnects without the risk of re-melt and degraded performance. Indalloy®301-LT is also available in preforms and ribbon configurations and can be offered flux-free or with Indium Corporation’s flux coating technology.

“With increasing mission profile demands in power electronics applications, such as EV power module-cooler integration, preform soldering offers superior thermal and mechanical performance compared to traditional thermal interface materials,” said Product Manager Joe Hertline. “By leveraging this new alloy technology in package-attach applications, designers can prevent warpage, encapsulation breakdown and delamination issues by reducing processing temperature, making preform soldering a viable approach with robust thermal and mechanical reliability performance.”

Indalloy®301-LT features:

• Reduced reflow peak temperatures by 50°C compared to commonly used alloys in power electronics assembly

• Prevention of warpage and delamination in molded power module package-attach

• Ability to step-solder with Pb-free alloys

• Excellent thermal and electrical conductivity

• Solid reliability performance (TST -40°C–125°C)

• Reduced energy consumption

• Available in preforms, ribbon, and InFORMS®

For more information about Indium Corporation’s high-reliability alloy products, visit www.indium.com/products/solders/solder-alloys/ or contact Joe Hertline at jhertline@indium.com.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.