MINNEAPOLIS – Nortech Systems, Inc., (Nasdaq: NSYS), a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products announced today Andrew LaFrence has been named CFO and Senior Vice President of Finance.

"We are delighted to welcome Andy to the Nortech Systems team," said Jay D. Miller, President and CEO of Nortech Systems. "Andy brings a wealth of experience and knowledge to the role, and I am confident he will be a great asset to our organization. Andy brings strategic expertise well beyond finance and accounting. The Nortech leadership team and board of directors are thrilled to have him on the Nortech team."

In his new role, LaFrence will be responsible for overseeing the company’s financial operations, including Nortech’s financial planning and accounting practices as well as its relationship with lending institutions, shareholders, the financial community and external auditors and tax advisors. LaFrence will work closely with Nortech’s senior leadership team and board of directors to direct the strategic focus, manage risk plus identify areas of opportunity and investment for the organization. LaFrence brings extensive strategic business planning experience and has provided executive leadership to the finance function with two public and several private companies.

In recent years, Nortech's strategic investments in the U.S., Mexico and China coupled with important measures to focus on growing EBITDA while developing research and innovation have diversified the company's capabilities and improved efficiencies to enhance profitability and support future growth. Nortech specializes in complex cable harnesses, printed circuit board assemblies (PCBAs) and box builds for low-volume, high-mix global manufacturing.

"I am excited to join Nortech Systems and help the company continue to grow and expand its capabilities," said LaFrence. "I look forward to working with the company’s exceptional team to ensure its financial success."

Nortech's 30-year history and rapidly growing expertise in digital connectivity and data management helps its customers stay competitive today and well into the future. With the addition of Mr. LaFrence to the team, Nortech Systems is well-positioned to continue its success and growth.

LYON, FRANCE – China’s semiconductor sector is on the rise as a global contender, propelled by progress in advanced node manufacturing. The Chinese industry occupies a strategic foothold in the memory market and is intensely active in the SiC race. This ecosystem is also developing core expertise in the advanced packaging field and has made substantial investments in cutting-edge manufacturing equipment.

Come and be part of Yole Group’s thrilling virtual event poised to ignite enthusiasm and curiosity within the semiconductor industry!

For one hour, the market research and strategy consulting company invites you to discover the status of the semiconductor industry in China, its underlying ecosystem, and related business opportunities.

This program welcomes six Yole Group experts to deliver their vision of the industry and highlight China’s market and technology assets:

“China is a key market for NAND and DRAM suppliers, as described in detail in Yole Group’s 2023 Status of the Memory Industry report,” explains Simone Bertolazzi, Principal Technology & Market Analyst, Memory at Yole Intelligence. “China strategically targeted this segment to reduce dependency on foreign suppliers. Key players, including Yangtze Memory Technologies Co. (YMTC), have invested significantly in technology development, positioning China as a potential major player in the global memory market.”

“China’s determination to dominate strategic semiconductor segments is evident in the SiC race,” asserts Poshun Chiu, Senior Technology & Market Analyst, Compound Semiconductor & Emerging Substrates at Yole Intelligence. “Chinese players are gaining market share, with plans for substantial capacity growth in the coming years. Companies like Cree and BYD are leading in developing SiC technologies, aiming to secure a significant share of the growing SiC market.”

“Advanced packaging has become a focal point, with companies like JCET emerging as key players,” explains Yik Yee Tan, Ph.D., Senior Market & Technology Analyst, Semiconductor Packaging & Assembly at Yole Intelligence. “By integrating advanced packaging capabilities, Chinese companies deliver innovative solutions for industries like 5G, AI , and IoT , strengthening China’s position in the global semiconductor supply chain.”

WEBINAR’S PROGRAM

• Power SiC
  The electrification of China’s automotive park is skyrocketing, with more than 20% of vehicles produced based on BEV platforms. Chinese players are gaining market share at the SiC wafer and epiwafer levels, and significant capacity is planned in the coming five years. For example, more than 40% of the total SiC wafer capacity in 2027 will be from China. Many regions in China are currently developing SiC businesses. More than US$1.5 billion in investments has been announced in SiC in China since 2022.
  Speaker: Poshun Chiu, Senior Technology & Market Analyst, Compound Semiconductor & Emerging Substrates at Yole Intelligence
• Computing
  The automotive ADAS/AD processor market is rapidly growing, with a CAGR of around 20%, and China is eager to be part of it. Tesla FSD HW4, Apple A17, HiSilicon 9000s: advanced computing chips are providing incredible performance with advanced nodes, and China intends to stay in the game. In a more than US$180 billion processor market, whether for consumer, automotive, or data center, China is investing heavily to reduce its dependence on foreign semiconductor technologies.
  Speakers: Ying-Wu Liu, Technology & Cost Analyst, Yole SystemPlus, and Adrien Sanchez, Senior, Technology & Market Analyst, Computing & Software
• Memory
  Combined stand-alone NAND and DRAM sales to China were worth around US$138 billion in 2022, corresponding to around 32% of all NAND and DRAM sales worldwide. Chinese players are developing and adopting hybrid bonding interconnection technology as an alternative to dimensional scaling. DRAM-Logic Integration: logic die and DRAM die bonded together through copper-to-copper hybrid bonding to increase chip bandwidth.
  Speaker: Simone Bertolazzi, Principal Technology & Market Analyst, Memory at Yole Intelligence.
• Semiconductor packaging
  The total revenue of the top ten Chinese OSATs grew 8% from 2021 to 2022, from US$11.4 billion to US$12.2 billion. Chinese OSATs are mainly focusing on mid-end Advanced Packaging platforms and targeting high-end technologies for the future. Significant investments by mainland China’s OSATs of more than US$4 million have been announced.
  Speaker: Yik Yee Tan, Ph.D., Senior Market & Technology Analyst, Semiconductor Packaging & Assembly at Yole Intelligence.
• Wafer Fab Equipment
  Substantial WFE revenue growth is expected in the areas where China invests: mature foundries, specialty and advanced packaging/OSATs. In terms of technology for >28 nm production, several WFE makers can already replace international equipment, but production capacities are limited.
  Speaker: Taguhi Yeghoyan, Senior Technology & Market Analyst, Semiconductor Equipment, Subsystems, and Testing

Register for the webinar here.

SAN JOSE, CA – Sanmina said that it has appointed Jon Faust as its CFO and executive vice president, effective Dec. 18.

Kurt Adzema, who previously held the role, will remain in the company in an advisory capacity until Jan. 5.

Faust has over two decades of experience in finance, accounting, controls and operations, and was previously the Global Controller and Head of Finance Transformation & Corporate Services at HP Inc.

DALLAS, TX – StenTech® Inc., the leading multinational SMT Printing Solutions company, today announced plans to exhibit at the SMTA Silicon Valley SMTA Expo and Tech Forum on Thursday, December 7, 2023. The event, held at Flextronics in Milpitas, CA from 8:30 am to 4 p.m., promises a firsthand look at StenTech's revolutionary SMT stencil manufacturing process, known for delivering the highest quality and performance with same-day turnaround.

StenTech’s expertise spans a diverse range of offerings:

Stencils: Explore our extensive range of high-quality stencil solutions, setting industry standards for precision and reliability. Visit our stencils webpage to learn more.

Coatings: Discover our award-winning StenTech Advanced Nano coating, designed to enhance transfer efficiency and available for same-day delivery. Visit our coatings webpage to learn more.

Tooling: Immerse yourself in cutting-edge tooling and wave solder pallet solutions that redefine industry benchmarks. Visit our tooling webpage to explore our innovative offerings.

Parts: Experience precision parts tailored to any shape, size, or quantity, crafted with our state-of-the-art chemical etching and laser-cutting technology. Visit our parts webpage to learn more.

Don't miss the opportunity to engage with our team, learn about our industry-leading solutions, and discover how StenTech continues to drive innovation in the SMT industry. To attend the Silicon Valley SMTA Expo and Tech Forum, register here. With a rich legacy of pioneering stencil technology and a team of more than 30 experienced CAD designers, StenTech remains at the forefront of stencil innovation. The company's introduction of Fiber Diode lasers in North America has significantly impacted the industry. By providing exceptional support in stencil modifications, material recommendations, and thickness specifications, StenTech ensures tailor-made stencil solutions that cater to the unique needs of every application. To learn more, visit www.StenTech.com