HARRISBURG, PA ― Cumberland Electronics Strategic Supply Solutions (CE3S), a leading provider of quality goods and services, is excited to announce its participation in the upcoming SMTA Capital Expo & Tech Forum. The event is scheduled to take place Thursday, March 7 at Sweeney Barn located in Manassas, VA.

As an exhibitor, CE3S offers a comprehensive range of professional solutions, providing the convenience of a one-stop shop for supplies with the agility and personalized approach of a family- owned business. Benefit from curated partnerships with reputable manufacturers, accessing a diverse range of high-quality products tailored to your industry, backed by our commitment to service and an excellent customer experience.

Among the featured solutions at the CE3S booth will be:

• Vendor Managed Inventory Solutions: A variety of solutions to alleviate pain related to inventory management.
• Strategic Account Solutions: Delivering solutions via true account management, sourcing, and supply.
• Value Added Service Solutions: Repackaging, converting services, custom labeling, custom packaging, cable assemblies, laser cutting, kitting, and 3PL services.
• Government Solutions: Serving the purchasing needs of all government agencies at the federal, state, and local/municipal levels.

CE3S is a broad-line distributor with a focus on providing professional solutions to diverse markets, offering products from hundreds of manufacturers. With a vast depth of products, CE3S serves as a one-stop shop for all supply needs.

In addition to its extensive product offerings, CE3S boasts a team of experts capable of providing invaluable expertise in various areas, including special project planning, sourcing, inventory management, workstation/workbench design and procurement, growth planning and product sourcing, government solutions, and ESD surveys and strategy.

Attendees are encouraged to visit the CE3S booth at the SMTA Capital Expo & Tech Forum to learn more about the company's comprehensive solutions and discuss their specific needs with the CE3S team.

To learn more, visit www.ce3s.com 

AUSTIN, TX – The competition is increasing in the OSAT space with Intel and Samsung offering OSAT services for silicon not fabricated in their foundry. TechSearch International examines high-performance packaging offerings from top OSATs and foundries with a score card for the options. This competition may be driven by the shortage in assembly capacity for AI packages used for training and inferencing. With increased capacity coming online for silicon interposers, chip-on-wafer (CoW) assembly, and high bandwidth memory (HBM), the assembly crunch is expected to ease by the end of the year. High Density Fan-Out (HDFO) using redistribution layers (RDL) instead of silicon interposers is emerging as an option.

It has been used for AMD’s machine learning and Apple’s high-end graphics computing station for several years, and automotive companies are exploring its use for future chiplet designs. Intel continues to use its embedded silicon bridge in a laminate substate. TechSearch International’s latest analysis describes AI market trends with a new market projection for training and inferencing packages.

The report analyzes build-up substrate supply and demand, finding no shortage in the overall industry. AI, server CPUs, and network switch packages continue to drive the growth in body size. With pull back in capacity plans and the growth in body sizes, supply and demand will become tight in 2028. Fortunately, the new plants coming online have higher yields. The report also examines the market for flip chip bonders used in fine pitch device assembly.

The electronics industry continues to burn through inventory, but this year’s decline in smartphone and PC shipments made it a difficult year, as reflected in OSAT financials. The outlook is brighter this year. OSAT financials are highlighted in the report.

The semiconductor industry is experiencing renewed attention from governments around the world. The report highlights some of the plans and list various incentives offered by governments globally. A list of U.S. government funded projects and programs, award winners, and activity is provided.

The latest Advanced Packaging Update is a 60-page report with full references and an accompanying set of more than 60 PowerPoint slides.

CHICAGO – In a strategic move to enhance its presence in the electronics market, Bimos, a leading innovator in seating for industrial and laboratory environments, proudly announces the appointment of Don Dennison as its new representative for ESD Seating, covering the Northeast. This partnership is set to redefine standards in ergonomic and safe seating solutions within the electronics sector.

Don Dennison, known for his extensive experience and significant contributions to the electronics industry through his leadership at PIT – Equipment Services, LLC, brings a wealth of knowledge and a track record of success to Bimos. His expertise will be instrumental in introducing Bimos’ high-quality, ergonomically designed ESD seating solutions to a market that demands precision, reliability, and comfort.

“Bimos' ESD seating solutions stand out for their innovative design and exceptional ergonomics, ensuring that they meet the rigorous demands of the electronics industry,” commented Dennison. “Their commitment to quality, combined with a focus on ergonomic benefits, makes these chairs essential for any high- tech workspace. I’m excited to represent a brand that so perfectly aligns with the needs of our clients, providing not just seating, but a foundation for better work and health.”

“We are thrilled to have Don Dennison on board to introduce our ESD seating solutions to the electronics market,” added Mark Scelfo, US Managing Director, Bimos. “His expertise and deep understanding of the industry’s needs make him the ideal partner for Bimos. This is a significant step forward in our mission to enhance workplace ergonomics and safety. We are excited about the opportunities this partnership will unlock and look forward to making a substantial impact on the electronics sector together.”

Bimos’ ESD seating offering, including the acclaimed Neon, Nexxit and Labsit series, is designed to meet the specific requirements for the electronics industry. The Bimos products embody the brand’s commitment to design innovation, exceptional quality, safety certifications and ergonomic excellence, making them a preferred choice for businesses looking to invest in their employees' health and productivity.

For more information about Bimos and its ESD seating solutions, please visit https://www.bimos.com/B/uk-en/products/esd-area

OLDHAM, UK – Solderstar, a global leader in temperature profiling equipment for soldering processes, is set to showcase its latest innovation, the Reflow Shuttle with O2 measurement module, at the IPC Apex Expo 2024 from April 9th to 11th. This eagerly anticipated event, to be held in Anaheim, California, marks Solderstar's debut presentation of this advanced new technology to the US market.

The Reflow Shuttle O2 represents a significant advancement as the first repeatable verification tool that combines real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single robust platform. This ground-breaking consolidation of key parameters gives manufacturers comprehensive insights to make informed decisions and optimize their reflow soldering processes to achieve higher precision in their advanced soldering applications.

Precise control over O2 levels is paramount in electronics manufacturing due to its potential impact on solder joint quality. Oxygen can lead to oxide formation on metal surfaces during heating, purging the reflow process with nitrogen results in improved wetting and solder joint integrity. The Reflow Shuttle O2 enables granular monitoring of oxygen levels within each zone, allowing nitrogen consumption to be quantified and process issues detected such as oven sealing issues.

CEO of Solderstar, Mark Stansfield said: "Reflow soldering demands precision and control. The Reflow Shuttle O2 delivers a detailed insight into critical parameters, equipping manufacturers with the tools needed for informed decision-making and process optimization. By consolidating measurement systems onto a single, robust platform, including O2 ppm, vibration levels, vacuum, temperature profiles, and conveyor speed, we're providing manufacturers with the knowledge to enhance quality and efficiency in their soldering operations with a single pass through the machine.

“We're looking forward to introducing this solution to visitors at IPC Apex, demonstrating our ongoing commitment to advancing industry standards."

A key feature of the Reflow Shuttle O2 is its zone-by-zone analysis of oxygen levels throughout the reflow process. This granular insight allows manufacturers to monitor oxygen content precisely and detect nitrogen leaks throughout the oven zones, pinpointing any oxygen fluctuations. Manufacturers can use this data to optimize nitrogen consumption and ensure process quality is maintained.

Moreover, the Reflow Shuttle O2 offers seamless integration into existing reflow ovens, eliminating downtime during verification. Its user-friendly interface enables machine operators to initiate data collection effortlessly, facilitating immediate adjustments if irregularities are detected. The tool's versatile design, including a specially designed battery pack and Smartlink connector, ensures uninterrupted verification across multiple production lines.

In addition to the Reflow Shuttle O2, Solderstar will also showcase its zero set-up SLX thermal profiler during the exhibition. The SLX unit, renowned for its accuracy and compact design, offers comprehensive data capture capabilities, further enhancing process control and product quality.

Attendees are invited to visit Booth 2538 at IPC Apex Expo 2024 in Anaheim, California, to see the new Reflow Shuttle O2 in action and explore Solderstar’s latest profiling equipment for reflow, wave, vapor, and selective soldering.