Products
HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.
Press Releases
- Libra Industries Expands Precision Fabrication Capabilities in Guaymas with Advanced Amada Laser System
- Distron Adds Second Juki Selective Soldering System to Support Growing Production Demand
- Amtech’s New Process Upgrades Elevate Transparency, Speed, and Manufacturing Readiness
- FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot