Products
10 650V silicon carbide (SiC) Schottky diodes feature merged PIN Schottky (MPS) design.
SMT 158D8 high thermal conductive underfill is a diamond-filled, reworkable liquid epoxy. Has thermal conductivity of >6W/mK, high salt-moisture resistance, and excellent adhesion.
W series embedded Wi-Fi antennas offer range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band operating frequencies up to 6GHz, performance-enhancing foam coatings, and various mounting options.
Press Releases
- Libra Industries Expands Precision Fabrication Capabilities in Guaymas with Advanced Amada Laser System
- Distron Adds Second Juki Selective Soldering System to Support Growing Production Demand
- Amtech’s New Process Upgrades Elevate Transparency, Speed, and Manufacturing Readiness
- FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot