Circuits Assembly Online Magazine - Current Issue

Products

ALPHA EF-6000 rosin-free wave solder flux is designed for lead-free and tin-lead processes. The alcohol-based, no-clean flux reportedly provides superior solderability and high yields as processes are transitioned from tin-lead to lead-free.

Offers in-circuit pintestability and electrical reliability in tin-lead and lead-free wave soldering applications. IPC rated ROL0, exceeds the Bellcore and JIS standards for electromigration and surface insulation resistance.

Cookson Electronics Assembly Materials, alphametals.com

The line of 5145P3 Series PCB mount mini-din connectors will now be available with a full metal shield and EMI/RFI gaskets on the mounting face for conducted and radiated noise suppression. Available in 3 through 8 pin configurations, the gasket option for is the same one used on the RJ-45 connector line. The new connectors also have high temperature material in the housing and can be ordered in a RoHS-compliant configuration.

The conductive gasket provides EMI/RFI noise attenuation and is interchangeable with shielded and unshielded versions (same footprint and panel cutout). The connectors are said to be easy to mount.

They provide easily identified pin configurations for applications that require multiple mini-din connectors on a single PC board or device.

Regal Electronics Inc., regalusa.com

EP77M-F is a two-component, silver filled, electrically conductive epoxy adhesive for high-performance bonding. The compound has a low volume resistivity of 10^-3 ohm-cm. It will set up in 5-10 min. at room temperature, even when applied in very small amounts. Full cure usually takes 8-12 hrs at room temperature. Electrical conductivity is first detectable within 30-60 min.

Has high bond strength to similar and dissimilar substrates. Adheres to metals, glass, ceramics, vulcanized rubbers and most plastics. Bonds are resistant to thermal cycling and chemicals including water, oil and most organic solvents. Has a service operating range of 4°K to +125°C.

Has a one-to-one mix ratio, by weight or volume. Can be applied with minimal sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents.

Available in glass jars, metal containers or syringes.

Masterbond, masterbond.com