Circuits Assembly Online Magazine - Current Issue

Products

A new tier of elastomeric connector products is available with proprietary Z-Alloy material. The connectors combine the reliability of solid metallic contacts with the flexibility of the silicone support material into one economical package. Are corrosion-resistant and offer a cost savings compared to traditional gold-plated contacts.

Standard connectors feature .002" (0.05 mm) wide conductors on .004 " (0.1 mm) centers for a conductor density of 250 per inch. Despite the fine geometry of the contacts, the material is said to be strong and durable enough to withstand repeated uses and will not break or fracture.

Z-Axis Connector Co., zaxisconnector.com

ALPHA CoolCap thermal protection device cools components and semiconductor packages during high-temperature lead-free reflow and rework processes.

Said to provide cost-effective protection without a substantial investment in process changes and redesign, while maintaining the high yield and throughput required by electronic assemblers. The reusable custom-fitted caps keep semiconductor packages below 245°C or 260°C and minimize temperature variation within packages from over 10°C down to 2-5°C, while minimizing warpage, popcorning and delamination.

Can be used in no-clean, water-soluble or RMA processes as a temporary heat sink that can be placed on components either by hand or with existing pick-and-place equipment. No adhesive is required and no residue is left on boards or components. Can be designed to cool the package body, allowing reflow underneath, or to "overcool" - preventing reflow in cases such as adjacent packages during rework.

Cookson Electronics Assembly Materials, alphametals.com

Recent test results have validated the superior moisture resistance of protective coating PC10882, a mineral-filled epoxy dielectric material designed to be screen-printed onto a range of substrates as a protective coating for trimmed resistors and general circuit protection. The cured film is tough and offers protection against thermal shock, solvent attack, moisture, abrasion, oxidation and plating processes.

Although a proven solution in the marketplace for almost a decade, recent tests conducted over the last year surpass expectations in moisture and temperature resistance.

Moisture testing involved saturation in a pressure cooker for one hour before dipping into dip in 260°C solder pot and then performing a tape adhesion test.

LORD Corporation, www.lord.com