Products
VJ Electronix will display the Model 1550 fully automated x-ray inspection system in booth 5626 at Assembly Technology Expo in Rosemont, IL.
Designed for the manufacturing floor, features large board x-ray inspection with automated motion control, measurement and analysis. Includes advanced solid-state detector-based inspection for lead-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface. Low maintenance, requires minimum operator intervention.
Is part of the 15XX Series, which is built around a choice of x-ray sources from 80 to 130 kV. 1550 offers a 130 kV x-ray source, with a continuously variable field of view (up to 1.8" with zoom).
Easy to learn, use and maintain. Provides: large-board handling area (18 x 24"), magnification 700X, low-maintenance, high MTBF, fully integrated compact system and image archiving in popular file formats.
The simple set up program using 1-2-GO interface allows users to characterize the entire process with one simple solution. Onscreen representation of boards for easy maneuvering allows for maximum productivity and quality assurance based on instant and accurate information.
Incorporates key innovations necessary for high-resolution x-ray microscopy:
· A revolutionary manipulator design that provides fast, accurate, repeatable sample positioning.
· The Nexus 300 software with 1-2-GO interface and onscreen sample representation for easy maneuverability
· CMOS-based 12 bit solid-state detectors for high-contrast resolution x-ray inspection.
Comes with an advanced image processor and a complete library of measurement and analysis tools. Proprietary New ElectroniX User Software (NEXUS) is used to enhance, analyze and view real-time x-ray images. The software comes with: advanced 1-2-GO based operator interface for easy programming in minutes; automated BGA analysis module (# of balls, void size, # of voids, ball size, pitch and circularity); percent void measurement module (user definable pass/fail thresholds); onscreen representation of sample; drill offset measurement module (deviation measurements, etc.); dimensional measurement module; wire sweep measurement module; quad-view display; Advanced Defect Enhancement module; histogram analysis tools (gray-level analysis); image filtering (3-D rendering, sharpen, relief, etc.) ; and pseudo color pallet manipulation.
VJ Electronix, vjelectronix.com
Designed for the manufacturing floor, features large board x-ray inspection with automated motion control, measurement and analysis. Includes advanced solid-state detector-based inspection for lead-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface. Low maintenance, requires minimum operator intervention.
Is part of the 15XX Series, which is built around a choice of x-ray sources from 80 to 130 kV. 1550 offers a 130 kV x-ray source, with a continuously variable field of view (up to 1.8" with zoom).
Easy to learn, use and maintain. Provides: large-board handling area (18 x 24"), magnification 700X, low-maintenance, high MTBF, fully integrated compact system and image archiving in popular file formats.
The simple set up program using 1-2-GO interface allows users to characterize the entire process with one simple solution. Onscreen representation of boards for easy maneuvering allows for maximum productivity and quality assurance based on instant and accurate information.
Incorporates key innovations necessary for high-resolution x-ray microscopy:
· A revolutionary manipulator design that provides fast, accurate, repeatable sample positioning.
· The Nexus 300 software with 1-2-GO interface and onscreen sample representation for easy maneuverability
· CMOS-based 12 bit solid-state detectors for high-contrast resolution x-ray inspection.
Comes with an advanced image processor and a complete library of measurement and analysis tools. Proprietary New ElectroniX User Software (NEXUS) is used to enhance, analyze and view real-time x-ray images. The software comes with: advanced 1-2-GO based operator interface for easy programming in minutes; automated BGA analysis module (# of balls, void size, # of voids, ball size, pitch and circularity); percent void measurement module (user definable pass/fail thresholds); onscreen representation of sample; drill offset measurement module (deviation measurements, etc.); dimensional measurement module; wire sweep measurement module; quad-view display; Advanced Defect Enhancement module; histogram analysis tools (gray-level analysis); image filtering (3-D rendering, sharpen, relief, etc.) ; and pseudo color pallet manipulation.
VJ Electronix, vjelectronix.com
Finetech has developed a Mobile Device Rework (MDR) System for the Fineplacer Pico for the demands of reworking mobile phones, PDAs, gaming handhelds, multimedia portables, Bluetooth and WLAN equipment, memory cards, notebooks and portable medical equipment such as pacemakers. The new system will be on display in booth 5002 at ATExpo in Rosemont, IL
Equipped with a new motorized placement module, the system achieves a degree of reproducibility unrivalled in manual rework and minimizes operator influence. WinCOMISS software controls bond force during placement and soldering, resulting in a production-compatible reflow process.
The lead-free capable system provides the capability to perform the entire rework process for the smallest of devices up to RF shield cans, and for extremely high-density packages. A fully automated version is also available to process pallets of system boards through the entire rework cycle: shield can and device removal, residual solder paste removal, printing, and device and shield replacement.
Also available, but not on display, is an optional integrated solder paste dispenser module that can dispense solder paste dots small enough for 01005 rework. It can also be configured to dispense epoxy and underfill.
Finetech Inc., finetechusa.com
Equipped with a new motorized placement module, the system achieves a degree of reproducibility unrivalled in manual rework and minimizes operator influence. WinCOMISS software controls bond force during placement and soldering, resulting in a production-compatible reflow process.
The lead-free capable system provides the capability to perform the entire rework process for the smallest of devices up to RF shield cans, and for extremely high-density packages. A fully automated version is also available to process pallets of system boards through the entire rework cycle: shield can and device removal, residual solder paste removal, printing, and device and shield replacement.
Also available, but not on display, is an optional integrated solder paste dispenser module that can dispense solder paste dots small enough for 01005 rework. It can also be configured to dispense epoxy and underfill.
Finetech Inc., finetechusa.com
BP Microsystems will highlight the 2710 concurrent programming system in booth 5635 at ATExpo. The company will also display a video showing its automated device programmers.
The 2710 combines 0.24 s/Mb programming technology, FX4 socket modules and the Concurrent Programming system for higher throughput, reduced cost per device and faster turnarounds. Improved the site hardware enables programming of devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications.
Designed specifically for high density devices and the associated longer programming times, including Flash. Programs a 64-Mb device in 15 sec. FX4 socket modules program up to four devices simultaneously per site. With two, four or six programming sites, the 2710 can program up to 24 devices at the same time. The programmer is compatible with all existing socket modules — standard and automated.
Supports all device packages, including but not limited to DIP, SDIP, PLCC, TSOP, SSOP, PCMCIA, SOIC, LCC, QFP, PQFP, PGA, SIMM, CSP, BGA, microBGA, TQFP and TSSOP. Guards against passing blank parts.
Supports more than 22,000 devices with very low voltage devices down to 1.5 V (Vdd), including, but not limited to, EPROM, EEPROM, Flash EPROM, Microcontrollers, PLD, CPLD, FPGA and antifuse FPGAs.
Supports more than 22,000 devices with very low voltage devices down to 1.5 V (Vdd), including, but not limited to, EPROM, EEPROM, Flash EPROM, Microcontrollers, PLD, CPLD, FPGA and antifuse FPGAs.
BP Microsystems, bpmicro.com
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