Products
KIC’s new profiler kit will be highlighted in booth 5511 at the upcoming AT Expo in Rosemont, IL.
The kit includes: SlimKIC 2000 profiler with 9 or 12 thermocouple (TC) inputs, Auto-Focus oven recipe search engine, metal shield, TCs rated to 400°C and aluminum tape. The kit enables manufacturers to set up and manage their lead-free thermal processes.
The new metal thermal shield offers better thermal protection while keeping the slim physical dimension of the “cool touch” shield. Some manufacturers process their parts in an inert atmosphere, requiring a tighter tunnel height. A low height thermal shield becomes imperative for such applications. Auto-Focus automatically recommends the appropriate oven recipe for any lead-free application before even running a profile. It also enables quick oven setup and allows manufacturers to optimize their thermal process along three dimensions: center of the process window for the most stable process; fastest throughput; and quickest oven changeover.
KIC, kicthermal.com
The kit includes: SlimKIC 2000 profiler with 9 or 12 thermocouple (TC) inputs, Auto-Focus oven recipe search engine, metal shield, TCs rated to 400°C and aluminum tape. The kit enables manufacturers to set up and manage their lead-free thermal processes.
The new metal thermal shield offers better thermal protection while keeping the slim physical dimension of the “cool touch” shield. Some manufacturers process their parts in an inert atmosphere, requiring a tighter tunnel height. A low height thermal shield becomes imperative for such applications. Auto-Focus automatically recommends the appropriate oven recipe for any lead-free application before even running a profile. It also enables quick oven setup and allows manufacturers to optimize their thermal process along three dimensions: center of the process window for the most stable process; fastest throughput; and quickest oven changeover.
KIC, kicthermal.com
Kester will showcase EnviroMark 907 (EM907), a no-clean, lead-free solder paste, in booth 5636 at AT Expo next week. Designed for high-yield, lead-free manufacturing, was engineered specifically for the higher thermal demands and higher melting temperature lead-free alloys, such as the SnAgCu (SAC) alloys.
Features a long stencil life, offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has excellent cold and hot slump behavior, preventing bridges and solder ball formation.
Said to have excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42.
Flux chemistry offers bright solder joints, even in air reflow. This cosmetic feature is an added benefit during inspection. The paste leaves only a light-colored residue and provides a stable tack life.
Reflowable in air or nitrogen, prints down to 0201 pad sites, has superior printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
Kester, kester.comhttp://www.kester.com
Features a long stencil life, offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has excellent cold and hot slump behavior, preventing bridges and solder ball formation.
Said to have excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42.
Flux chemistry offers bright solder joints, even in air reflow. This cosmetic feature is an added benefit during inspection. The paste leaves only a light-colored residue and provides a stable tack life.
Reflowable in air or nitrogen, prints down to 0201 pad sites, has superior printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
Kester, kester.comhttp://www.kester.com
Kyzen Corp. will highlight AQUANOX A4630 in booth 5834 at the upcoming Assembly Technology Expo.
Designed from the ground up to clean lead-free materials while providing low cost of ownership. This sixth-generation product brings ambient temperatures and low concentrations while exceeding industry standards for both people and environmental safety. It also is multi-metal safe for use on yellow metals, aluminum, ferrous and composites as well as most precious metals and some plastic, rubber, glass and ceramic substrates.
Typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Said to provide brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.
Equally effective on all no-clean materials.
Designed from the ground up to clean lead-free materials while providing low cost of ownership. This sixth-generation product brings ambient temperatures and low concentrations while exceeding industry standards for both people and environmental safety. It also is multi-metal safe for use on yellow metals, aluminum, ferrous and composites as well as most precious metals and some plastic, rubber, glass and ceramic substrates.
Typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Said to provide brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.
Equally effective on all no-clean materials.
Kyzen, kyzen.com
Press Releases
- KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
- ECIA Executive Conference Announces Session on eCrime Tradecraft
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing