Products
Building on the parallel processing method for high throughput, an MPM Accela system can operate in continuous run mode demonstrating a new inspection technology in development for release later this year. This system is designed for manufacturers requiring high volume throughput with high yield performance. Its
foundation is Speedline’s patented texture based inspection algorithms. This method uses a camera system which manages the gantry motion and field of view in a new way to perform full 2-D inspection of either or both the substrate and the stencil at line speed. This method will report the data to SPC for management of the process, including the data for BridgeVision and StencilVision inspection. Also has process control methods for process verification and traceability utilizing bar code identifiers.
Speedline Technologies, speedlinetech.com.
Digitaltest has released the second-generation Flying Prober Condor 500, which is said to ensure high speed as well as high accuracy.
The new platform is reportedly 30% faster, and comes with a unique Soft Landing tool and optional integrated boundary-scan. The Soft Landing technology allegedly addresses concerns that manufacturers face over test coverage on complex and high-density boards, and the problems of unwanted damage using conventional probe techniques.
Digitaltest also introduced the Concurrent In-Line ICT and Functional Test Cell from JOT Automation, Elektrobit Group. The jointly developed Test Handler J402-11 comes with an embedded Digitaltest Lambda concurrent tester with the following alleged features:
- Shortened test cycle time
- Increased test coverage and quality
- Minimized footprint
- Press force 3000 N (4500 N)
- Easy and quick fixture change
www.digitaltest.net, booth #1351
The Penta 580 Pb-Free HASL (Hot Air Solder Leveling) machine is manufactured by Pentagal in Germany. It is said to be designed to conform to the ban on lead soldering equipment scheduled to go into effect throughout Europe in 2006.
The PRS 77 optical lay-up, registration and bonding system for preparation of lamination stacks is from DIS in New York. This process reportedly increases layer-to-layer registration greatly over current solutions.
all4-PCB, all4-pcb.us
Booth 1883
Press Releases
- Seika Machinery to Host SMI 2026 Webinar Series Session 2 on PCB Slicing Methods and Low-Stress Separation
- Pillarhouse USA Expands BarTron, Inc. Sales Territory into Indiana
- Mycronic appoints Peter Andries as General Manager of MRSI Systems and VP of Global Technologies Division
- The Test Connection, Inc. Becomes First Test Engineering Company in Space