Products
KIC will display Wave Surfer, a new wave application fixture, in booth 5511 at AT Expo.
The self-contained measurement system for wave solder machines provides critical data on wave solder machine setup and its process. Has five embedded thermocouples, works in conjunction with SlimKIC 2000 for profiling and setup.
Made of a material similar to typical wave solder pallets, can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure the pertinent process data in the wave solder machine including peak temperature, dwell time, parallelism and conveyor speed.
KIC, kicthermal.com
The self-contained measurement system for wave solder machines provides critical data on wave solder machine setup and its process. Has five embedded thermocouples, works in conjunction with SlimKIC 2000 for profiling and setup.
Made of a material similar to typical wave solder pallets, can withstand thousands of passes. The fixture holds the SlimKIC in place during each run to measure the pertinent process data in the wave solder machine including peak temperature, dwell time, parallelism and conveyor speed.
KIC, kicthermal.com
KIC’s new profiler kit will be highlighted in booth 5511 at the upcoming AT Expo in Rosemont, IL.
The kit includes: SlimKIC 2000 profiler with 9 or 12 thermocouple (TC) inputs, Auto-Focus oven recipe search engine, metal shield, TCs rated to 400°C and aluminum tape. The kit enables manufacturers to set up and manage their lead-free thermal processes.
The new metal thermal shield offers better thermal protection while keeping the slim physical dimension of the “cool touch” shield. Some manufacturers process their parts in an inert atmosphere, requiring a tighter tunnel height. A low height thermal shield becomes imperative for such applications. Auto-Focus automatically recommends the appropriate oven recipe for any lead-free application before even running a profile. It also enables quick oven setup and allows manufacturers to optimize their thermal process along three dimensions: center of the process window for the most stable process; fastest throughput; and quickest oven changeover.
KIC, kicthermal.com
The kit includes: SlimKIC 2000 profiler with 9 or 12 thermocouple (TC) inputs, Auto-Focus oven recipe search engine, metal shield, TCs rated to 400°C and aluminum tape. The kit enables manufacturers to set up and manage their lead-free thermal processes.
The new metal thermal shield offers better thermal protection while keeping the slim physical dimension of the “cool touch” shield. Some manufacturers process their parts in an inert atmosphere, requiring a tighter tunnel height. A low height thermal shield becomes imperative for such applications. Auto-Focus automatically recommends the appropriate oven recipe for any lead-free application before even running a profile. It also enables quick oven setup and allows manufacturers to optimize their thermal process along three dimensions: center of the process window for the most stable process; fastest throughput; and quickest oven changeover.
KIC, kicthermal.com
Kester will showcase EnviroMark 907 (EM907), a no-clean, lead-free solder paste, in booth 5636 at AT Expo next week. Designed for high-yield, lead-free manufacturing, was engineered specifically for the higher thermal demands and higher melting temperature lead-free alloys, such as the SnAgCu (SAC) alloys.
Features a long stencil life, offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has excellent cold and hot slump behavior, preventing bridges and solder ball formation.
Said to have excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42.
Flux chemistry offers bright solder joints, even in air reflow. This cosmetic feature is an added benefit during inspection. The paste leaves only a light-colored residue and provides a stable tack life.
Reflowable in air or nitrogen, prints down to 0201 pad sites, has superior printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
Kester, kester.comhttp://www.kester.com
Features a long stencil life, offers lead-free joints that closely resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has excellent cold and hot slump behavior, preventing bridges and solder ball formation.
Said to have excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42.
Flux chemistry offers bright solder joints, even in air reflow. This cosmetic feature is an added benefit during inspection. The paste leaves only a light-colored residue and provides a stable tack life.
Reflowable in air or nitrogen, prints down to 0201 pad sites, has superior printing characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004 Flux Classification ROL0.
Kester, kester.comhttp://www.kester.com
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