Products
A new ProLINE-RoadRunner in-line programming solution is configured specifically for Siemens X-Series placement machines.
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
Concept FX is a multi-axis, x-ray inspection system featuring configuration flexibility with 80/90/130 kV x-ray source options, six axes of motion control, operator-friendly ergonomic design and a no-clamp sample tray for fast load and unload.
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
Focalspot,.focalspot.com
Loctite 3549 is a high flow underfill formulated for use with advanced CSP and BGA packages. Is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing.
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
