Products
Tyco Electronics’ Global Application Tooling Division (GATD) designed a customized RFID inlay assembly system for Graphic Solutions International (GSI). The equipment will assemble semiconductor chips, surface-mount devices and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.
Working closely with GSI to meet their specifications, Tyco provided a reel-to-reel system that allows GSI to mount flip-chips, SMDs and printed batteries onto printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ roll of 20" wide material. After conductive printing, the roll is fed into the machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip, and a printed antenna. The speed of this machine allows for production levels up to 26 million inlays per year.
The line can accommodate printed substrates from 0.002" (50 mm) to 0.005" (125 mm) thick, mount on continuous rolls with a repeat pitch of 0.8" (20 mm) and position chips to micron accuracy.
Tyco Electronics, tycoelectronics.com
Graphic Solutions International LLC, graphicsolutionsinc.com
Working closely with GSI to meet their specifications, Tyco provided a reel-to-reel system that allows GSI to mount flip-chips, SMDs and printed batteries onto printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ roll of 20" wide material. After conductive printing, the roll is fed into the machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip, and a printed antenna. The speed of this machine allows for production levels up to 26 million inlays per year.
The line can accommodate printed substrates from 0.002" (50 mm) to 0.005" (125 mm) thick, mount on continuous rolls with a repeat pitch of 0.8" (20 mm) and position chips to micron accuracy.
Tyco Electronics, tycoelectronics.com
Graphic Solutions International LLC, graphicsolutionsinc.com
The Feinfocus Cougar-SMT with CT can image complex components in 2-D and 3-D for quality assessment and process improvement.
Featuring a Feinfocus GUI, it includes a microfocus x-ray tube up to 160 kV, HDX-Ray real-time 16-bit image processing, digital flat panel detector and accelerated CT reconstruction and visualization. Provides feature recognition down to 1 µm, with total magnification up to 10,000X and True X-Ray Intensity (TXI) Control.
Users may add features such as BGA and die-attach void calculation modules, a more sophisticated manipulator system and a multifocus x-ray tube up to 160 kV. CT functionality is an available upgrade for existing systems.
Features a small footprint (approx. 1 x 1 m), low system weight (approximately 1,450 kg) and convenient front- and side-door service access.
COMET, comet.ch
Featuring a Feinfocus GUI, it includes a microfocus x-ray tube up to 160 kV, HDX-Ray real-time 16-bit image processing, digital flat panel detector and accelerated CT reconstruction and visualization. Provides feature recognition down to 1 µm, with total magnification up to 10,000X and True X-Ray Intensity (TXI) Control.
Users may add features such as BGA and die-attach void calculation modules, a more sophisticated manipulator system and a multifocus x-ray tube up to 160 kV. CT functionality is an available upgrade for existing systems.
Features a small footprint (approx. 1 x 1 m), low system weight (approximately 1,450 kg) and convenient front- and side-door service access.
COMET, comet.ch
LF-4300 is an RoHS-compliant Pb-free solder paste with multi-process capabilities, a single product for no-clean applications that is also water washable. Compatible with Pb-free, SnPb and high-temperature alloys, the versatile and forgiving solder paste can be cleaned using standard aqueous cleaning systems without saponification.
Manufactured using a proprietary formula, including synthetic materials for good printing characteristics, lot-to-lot consistency and long stencil life. Is VOC and halide-free, and is classified as REL0. When used as a no-clean with either SnPb and Pb-free alloys, flux residue remains clear and meets S.I.R. requirements per IPC-TM-650.2.6.3.3.
Features include:
· Complies with RoHS directive 2002/95/EC for lead-free
· Suitable for high temp. alloys up to 300oC
· No mid-chip beading
· Low voiding
· 12-hour stencil life
· 24-hour abandonment time
· Pin Probable for ICT inspection
· Compatible with AOI inspection
· Works well in a vapor phase process
AMTECH, amtechsolder.com
Press Releases
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