Products
FLX500 is a self-contained, automated device programmer that fits on a desktop. The system will be introduced at Nepcon UK and Semicon Singapore next week.
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
“Customers constantly share with us the costly problems they have with gang programmers – bent leads, blank devices, incorrectly programmed devices, high levels of scrap – but at the same time they often do not have the facilities, the operators, the time for training, or the physical space required for a sophisticated automated programming system,” said Megan Miller, director of marketing. “The FLX500 offers a solution that drastically reduces the errors and waste inherent in manual programming. The FLX500 is modular and expandable, it supports virtually all device packages, and it is ideally sized to fit almost anywhere.”
Enables ‘plug and program’ automated programming. Touch screen user interface is language independent, eliminating operator training and mistakes. Requires no special installation. Can be plugged into a standard wall outlet. Self-contained air supply eliminates the need for an external air system. Picks devices from tray media, places them in sockets for programming, and returns programmed devices to output trays.
Has FlashCORE precision programming technology, with high-speed programming for leading Flash and serial memory devices, NAND flash and programmable microcontrollers. Supports BGA, mBGA, CSP, PLCC, TSOP, QFP and others, with throughput over 500 devices/hr.
A flexible rental option allows EMS companies, for example, the flexibility needed to meet short-term or volatile contract requirements without a major capital investment.
Data I/O Corp., www.dataio.com
NEPCON, UK
Booth G37 (with Accelonix)
Semicon, Singapore
Booth 928 (with TransTechnology PTE Ltd.)
Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series. Offers process control and high productivity.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules.
Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
Alphasem AG, alphasem.com
GÖPEL electronic introduces the SFX-5704 as additional component to the JTAG/Boundary Scan hardware platform Scanflex. The I/O Module (SFX Module) was developed for the production test of mixed-signal applications and provides four parallel and independent channels.
Can be freely combined with controllers on PCI, PXI, USB, FireWire or LAN basis as well as TAP transceivers with distances up to five metres.
Each of the four channels features a fully-fledged driver/sensor pin electronic combined with an analog measuring function. For digital tests each channel can be switched to Input, Output, Bidir or Tri State (interposing relay). Individually programmable parameters such as input-voltage (±10V), output-voltage (±10V), maximum driver current up to 300mA and programmable Pull Up and Pull Down resistors enable an application oriented test channel adaptation to the signals to be tested.
Safety measures for the Unit Under Test include automated overcurrent recognition with subsequent current limit (fold back), dynamic driver current gain adaptation (backdriving) as well as a specific clip switching for freely programmable oppression of overshoots on the connected signal lines.
The analog measuring function has an input range of ±10V at a 12 bit resolution. Analog and digital functions can simultaneously be operated at active clip switching.
GÖPEL electronic, www.goepel.com
Can be freely combined with controllers on PCI, PXI, USB, FireWire or LAN basis as well as TAP transceivers with distances up to five metres.
Each of the four channels features a fully-fledged driver/sensor pin electronic combined with an analog measuring function. For digital tests each channel can be switched to Input, Output, Bidir or Tri State (interposing relay). Individually programmable parameters such as input-voltage (±10V), output-voltage (±10V), maximum driver current up to 300mA and programmable Pull Up and Pull Down resistors enable an application oriented test channel adaptation to the signals to be tested.
Safety measures for the Unit Under Test include automated overcurrent recognition with subsequent current limit (fold back), dynamic driver current gain adaptation (backdriving) as well as a specific clip switching for freely programmable oppression of overshoots on the connected signal lines.
The analog measuring function has an input range of ±10V at a 12 bit resolution. Analog and digital functions can simultaneously be operated at active clip switching.
GÖPEL electronic, www.goepel.com
Press Releases
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- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin