Products
PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.
Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.
Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin