FT230 XRF analyzer is designed to enable quality control by simplifying and accelerating testing of components and assemblies.
AOX755 flux-filled high-performance solder wires are based on two soft solder alloys filled with three cores of flux compound EO-FC-006.
Etimol defoamer DFL-100 and DFL-C anti-foaming agents can be used in machine-based cleaning to prevent uncontrolled foam development.