Products
HCT-910 hot air rework system is accurate and intuitive-to-use, with high thermal performance capable of meeting the full spectrum of application requirements needed for production and rework in electronics manufacturing.
Profiling Software 2G and SPS Smart Profilers now come with optional Dual Profiling, permitting up to 24 thermocouple locations in a single profile run for temperature profiling measurements.
PF918-S lead-free BGA spheres is formulated with SnAg4.0Bi3.0 alloy designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
Press Releases
- Yamaha Robotics Introduces a New Program to Minimize Onshoring Costs in North Americ
- Scanfil Appointed Anna-Maria Tuominen-Reini as Chief Supply Chain Officer
- BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services
- ProcureAbility Releases New Benchmarking Report Confirming Widespread AI Development and Adoption in Procurement with Focus on Targeted Enterprise Results