The T-2800 self-contained precision temperature forcing system for electronic component testing incorporates a built-in air compressor that reportedly eliminates the need for an external air supply at the test location. Has a temperature range of -60˚C to 200˚C, an airflow rate of 300 SCFH, a small footprint, and an intuitive user interface. Incorporates a receiver tank; after-cooler; water separator; a heatless desiccant air dryer; an integrated test arm, a pneumatically controlled test head, and self-diagnostics capability.
Model 40366 surface-mount accelerometer is said to have capabilities ideal for implantable medical device applications. Is a variable capacitance, silicon MEMS device designed to meet the requirements for use in implantable devices. Hermetically sealed with a shear bond strength of 1 kg; delivers repeatability of less than 0.035 pF in an SMT footprint of 2.05 x 2.90 mm configured as a three-terminal half-bridge. Features include frequency response of 40 Hz, linearity of less than 1%, transverse sensitivity of less than 1%, a +/-2g full scale for measurement of fractional-g accelerations in the presence of earth’s gravity, and over-range stops with provisions to eliminate electrostatic sticking when the accelerometer is over-ranged.
The Dow Corning DA-6534 high-performance thermal adhesive addresses the issue of overheating in advanced flip-chip BGA devices. Combines silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures. Achieves thermal resistance of 0.09 cm2 C/W at 24µ. Said to offer good dispensability. Bondline thickness can be controlled through pressure and time.