Asscon Vapor Phase technology is said to be the most versatile reflow system for Pb-free and leaded applications. Maintains peak temperature of a small resistor while reaching a suitable liquidous period for larger, adjacent devices. All parts reportedly reach the same peak temperature; local differentials are reportedly nonexistent. Bringing the circuit back to a liquidous state in a non-turbulent chamber permits removal of and replacement of high mass/value parts without exerting high levels of mechanical stress on the PCB or parts by creating local temperature differentials. Is conducted in an oxygen-free environment, with minimal or no fluxing, and no extraction for operators. Removal process guaranteed not to take place until the joints are liquidous.
Uni-form epoxy preforms are available in M5-82, a linear epoxy system that remains flexible under temperature changes. Post-cure flexibility said to improve adhesion to component materials with dissimilar coefficients of thermal expansion. Developed for under-the-hood automotive applications and other environments that require seal integrity under adverse temperature conditions. Are one-part epoxy resins solid at room temperature. Melt and cure when heated, forming a seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. Close tolerances on preform dimensions; consistent pre-mixed ratios of resin to catalyst; and consistent viscosity from beginning to end of batch ensure uniform. Available with outside diameters from 0.035" to 0.720". Can be dispensed as rapidly as 200 to 600 parts per minute. Said to eliminate pot-life concerns and cleanup procedures.
Medalist i1000 offers the VTEP v2.0 vectorless test suite, which comprises iVTEP and network parameter measurement technology. Reportedly offers unparalleled coverage of micro ball grid arrays and flip chips, as well as power and ground pins for connectors found in digital consumer products and desktop PCs. Is compatible with most MDA fixtures. An AutoDebug feature slashes debugging time to a few hours. Comes with an automatic node-guarding feature that is said to eliminate the need for manual checks of schematics for guard points. Offers two fixture options. Provides fast fixture-swapping time while maintaining high signal integrity. Available in June.