Products
The ‘First-Time-Right’ NPI Stencils Initiative for the Alpha product line is said to reduce NPI cycle times. Provides design recommendations for accurate paste volumes and locations; automated application of preprogrammed customer and OEM/product-specific design rules; means to apply a single set of design rules across multiple sites; PCB scaling service that optimizes stencils to better correct for board stretch; regular monitoring and control of the positional accuracy of lasers; stepped stencils and aperture designs to permit single stencils designed for range of deposit volumes.
Cookson Electronics Assembly Materials, www.cooksonelectronics.com
Indium9.32 Die-Attach Solder Paste is a halogen-free, no-clean, die-attach solder paste. Is used in high-volume manufacturing for Pb-free die-attach applications. Is said to exhibit low voiding (<5% total voiding achievable in most instances), as well as ultra-low residue.
Indium, www.indium.com
K7000 circular linear blade depanelizer singulates pre-scored PCBs with tight component spacing. The linear blade is 12" long and has a 0.030" thin symmetrical cutting edge. The circular blade is 3.8" in diameter and has the same cutting edge profile as the linear blade. This blade is mounted on a shaft with the center line passing through the middle of the support bearing. For singulating panels with components such as BGA sockets that encroach on the edge of the board. Unit weighs less than 30 lbs.
FKN Systek, www.Fknsystek.com
FKN Systek, www.Fknsystek.com
Press Releases
- RBB Welcomes Shawn Myers as Engineering Project Manager
- ECIA’s Market Sentiment Index Average Hits Five-Year High in June Industry Pulse Survey
- Incap Slovakia invests in cleanroom capability to support semiconductor manufacturing requirements
- Orbit Technologies accelerates growth and doubles production capacity with Europlacer iineo placement machine