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Trek Model 900 is a diagnostic tool for identifying or investigating suspected ESD incidents. Includes a voltage-sensitive antenna that can be positioned near potential problem areas to monitor ESD events. Detection is conveyed via an audible buzzer and/or a visual color-coded light display that depicts intensity. Is compact, portable and powered by batteries or continuous AC. CE compliant.
 
Trek, www.trekinc.com
 
 
The YTX X3 3-D x-ray inspection system is for PCBs with BGAs and other hidden solder joints. Proprietary imaging technology gathers oblique images to construct a 3-D rendering used to identify solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions on a board. Programming is said to be fast and intuitive, with a typical complete inspection program created in fewer than 30 min. Is suited for in- or offline applications and reportedly offers fast throughput and low false calls. Included are remote programming and real-time SPC software.

YESTech Inc., www.yestechinc.com 
Press-Fit, Solderless Interconnect Technology permits assembly of a terminal or electrical lead with a plated through-hole to create a solderless electrical connection. Reportedly is fully tested to meet operating requirements, and has passed standard automotive testing requirements for vibration and for temperatures up to 125°C. Material thicknesses for eye-of-the-needle-based press fit designs are 0.64 and 0.80 mm.

Interplex Industries, www.interplex.com

 

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