Products
XF3 Pb-free solder paste reportedly accommodates extended reflow profiles without use of nitrogen. Is based on patented SN100C alloy, which reportedly has demonstrated long-term fatigue strength over silver-containing SAC-alloys. Is said to remedy copper migration into tin regions of the solder joint. Wetting on all common metal surfaces is said to be excellent. Prints at 150-200-mm per sec.
Cobar Europe, www.cobar.com
System Caston boundary scan software is said to enhance integration with flying probe testers. Enables interaction between flying probe and boundary scan access for board level test applications, embracing IEEE1149.1 applications. Includes management of boundary scan and non-boundary scan components and automatic test program generation, using automatic pin fault diagnostic, graphical fault localization, and debugging. Has new control algorithm. Detected faults are diagnosed after test execution by means of intelligent pin fault diagnostic processors. Includes ScanAssist multi-mode debugger.
Goepel electronic GmbH, www.goepel.com
Goepel electronic GmbH, www.goepel.com
NC162 is a third-generation liquid flux for use with high-activity, halide-free no-clean alloys, especially in palletized processes. Is said to work well with SN100C alloy, and for soldering through-hole and mixed-technology assemblies. Benefits include halide-free, Pb-free compatible, low post-process residues and activity to promote hole fill. Is said to become more robust in high-temperature applications. Can be sprayed, foamed or dipped.
FCT Assembly, www.fctassembly.com
FCT Assembly, www.fctassembly.com
Press Releases
- K&F Electronics Boosts Production with New Hanwha SMT Line
- Luminovo Appoints SaaS Veteran Clifton Lobo as VP Global Sales to Accelerate International Growth
- Johan Stormlund Joins Inspectis AB as Marketing and Sales Manager, Industrial Applications
- Altus Brings Heller’s Revolutionary Short-Cycle Vacuum Reflow Oven to the UK and Ireland