Products
Würth Elektronik USB 3.1 Type-C High-Rise SMT Connector is a 24-pin fully-configured horizontal receptacle for SMT assembly.
Solderstar Reflow Shuttle O2 measurement module is a repeatable verification tool that combines O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed on a single platform.
Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications.
Press Releases
- MaRCTech2 Hires Kiersten Kreusser as Solutions Expert for Oregon and Southwest Washington
- OKI Launches EMS for AI Server Equipment Featuring Proprietary High Heat Dissipation Technology
- ECIA Announces 2026 Executive Conference Core Committee Members
- Arbell Electronics Named Zestron's 2026 Distributor of the Year at APEX EXPO