Shenmao's PF606-P130N is an anti-hop lead-free solder paste that is designed for the SMT process to prevent head-on-pillow (HoP) issues.
Rohm Semiconductor's BD14210G-LA current sense amplifier IC simplifies current sensing by connecting a shunt resistor and a bypass capacitor, which reduces the number of components from 11 to just three compared to conventional configurations.
Dymax's 9200-W series of light-curable encapsulants and structural and optical-positioning adhesives is made without materials of concern known to cause skin sensitization.