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S01X7C48-M500 Pb-free solder paste is a SnAg0.1Cu0.7Co+X0.03 alloy. Reportedly offers superior solder joint reliability and head-in-pillow performance over SAC 305. Is halogen-free. Has higher shear strength and greater shock absorbing ability than SnAg3Cu0.5.

Koki, www.ko-ki.co.jp

ERO-500 midrange reflow soldering system has five vertical heating zones and one cooling zone. Developed for small- to medium-volume reflow soldering of SMT and hybrid boards, and curing glue or thick-film pastes. Has a maximum system temperature of 320°C; reflow profiles can be optimized for Pb-free and SnPb profiles. Each heating zone is independently programmable and controlled via on-board LCD system controller. Reflow profiles can take into account conveyor speed, heating temperature, convection heat flow, and cooling fans. Data port included for downloading profile data and error logs.

APS Novastar, www.apsgold.com

MC-388LED is suited for LED panel assembly of up to 1.2 m in a single pass. Has 192 tape feeder capacity; performs pick-and-place for larger backplane boards requiring multi-feeders. Cognex-based on-the-fly alignment mounts any SMD from 0.4 mm x 0.2 mm to 16 mm x 14 mm, including flip-chips, CSPs and µBGAs. Upward-looking vision permits placement of larger components up to 150 mm x 100mm, BGAs, QFPs and connectors. Features ball-screw X-Y drive, closed-loop servo control with linear encoding, and placement accuracy of 30 µm, 3 sigma. Is available with two or four heads, achieving placement speeds from 6,500 to 10,000 CPH. Waffle trays and stick feeders may be accommodated in a placement area of 408 mm x 1200 mm. Conveyors for special applications are available.

Manncorp, www.manncorp.com

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