ERO-500 midrange reflow soldering system has five vertical heating zones and one cooling zone. Developed for small- to medium-volume reflow soldering of SMT and hybrid boards, and curing glue or thick-film pastes. Has a maximum system temperature of 320°C; reflow profiles can be optimized for Pb-free and SnPb profiles. Each heating zone is independently programmable and controlled via on-board LCD system controller. Reflow profiles can take into account conveyor speed, heating temperature, convection heat flow, and cooling fans. Data port included for downloading profile data and error logs.

APS Novastar, www.apsgold.com

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