Products
Vision System Alignment provides fiducial location (used to align the PCB to the stencil in X/Y/Theta) and post-print inspection (used to detect over and under print). Uses a high-resolution 1024 x 768 pixel resolution camera system. Fiducial location function features pattern recognition to locate fiducials on the PCB and stencil. Includes multi-stage sub pixeling algorithms. 2-D Post-Print Inspection function reportedly ensures proper solder paste application to the printed circuit board with a field of view of 63 mm2 and an inspection shot rate of < 220 ms. Grayscale-based inspection detects excess solder paste and insufficient solder paste.
Milara, www.milarasmt.com
M.O.L.E. MAP 3 free software moves from separate programs to one that now supports all current ECD instrument platforms. Has nine environments: user selectable combinations of M.O.L.E. and RIDER pairing that separate one profiling data acquisition activity from another. Environments are basic profiling; WaveRider; OvenRider; OvenChecker; MiniMOLE rH; solar metallization and others.
ECD, www.ecd.com
M.O.L.E. MAP 3 free software moves from separate programs to one that now supports all current ECD instrument platforms. Has nine environments: user selectable combinations of M.O.L.E. and RIDER pairing that separate one profiling data acquisition activity from another. Environments are basic profiling; WaveRider; OvenRider; OvenChecker; MiniMOLE rH; solar metallization and others.
ECD, www.ecd.com
Press Releases
- SEMI Applauds Statement from Senators Crapo and Wyden Supporting U.S. Tax Credit for Semiconductor Manufacturing
- ECIA’s July Industry Pulse Sentiment Index Suffers Summer Slide and Dips 12.5 Points from June High
- Datest to Host Siemens EDA Webinar on Data-Driven PCB Test Planning for Increasingly Complex Electronics Designs
- StenTech Expands North American Manufacturing Capacity Through Strategic Investment